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Novel rapid solidification low-temperature conductive silver paste and preparation method therefor

A conductive silver paste, fast curing technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as no bending resistance, and achieve the effect of short curing time

Inactive Publication Date: 2018-08-24
SINO PLATINUM METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although it is a low-temperature fast-curing conductive silver paste, it is mainly a silver paste for touch screens, which has no bending resistance, and it takes 7-15 minutes to cure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A new fast-curing low-temperature conductive silver paste, its composition and weight percentage are: silver powder 48%, thermoplastic resin 8%, thermosetting resin 1%, thermosetting agent 0.5%, auxiliary agent 2%, solvent 40.5%. Among them, the surface of the flaky silver powder is treated with hydrophobicity, the diameter-thickness ratio is 10-40, the particle size range is 0.1-4μm, and the specific surface area is 1.2g / m2 2 , tap density 2.5g / cm 3 ; Thermoplastic resin is the polyurethane of glass transition temperature-12 ℃; Thermosetting resin is the aldehyde ketone resin of hydroxyl value 100; Curing agent is isocyanate; Auxiliary agent is organic bentonite; Solvent is 20% dimethyl succinate, 60% by weight percentage % dimethyl glutarate, 20% dimethyl adipate.

[0019] The preparation method of a novel fast-curing low-temperature conductive silver paste of the present invention comprises the following process steps: weighing the raw materials according to the mas...

Embodiment 2

[0022] A new fast-curing low-temperature conductive silver paste, its composition and weight percentage are: 50% silver powder, 8% thermoplastic resin, 1% thermosetting resin, 0.5% thermosetting agent, 2% additive, and 38.5% solvent. Among them, the surface of the flaky silver powder is treated with hydrophobicity, the diameter-thickness ratio is 20-50, the particle size range is 0.1-5μm, and the specific surface area is 1.0g / m2 2 , tap density 3.0g / cm 3 ; Thermoplastic resin is the polyurethane of glass transition temperature 16 ℃; Thermosetting resin is the aldehyde ketone resin of hydroxyl value 150; Curing agent is isocyanate; Auxiliary agent is modified urea; Solvent is 16% dimethyl succinate, 48% by weight percentage % dimethyl glutarate, 16% dimethyl adipate, 20% isophorone.

[0023] The preparation method of a novel fast-curing low-temperature conductive silver paste of the present invention comprises the following process steps: weighing the raw materials according t...

Embodiment 3

[0026] A new fast-curing low-temperature conductive silver paste, its composition and weight percentage are: 50% silver powder, 8% thermoplastic resin, 1% thermosetting resin, 0.3% thermosetting agent, 0.5% additive, and 40.2% solvent. Among them, the surface of the flake silver powder is treated with hydrophobicity, the diameter-thickness ratio is 10-60, the particle size range is 0.1-3.5μm, and the specific surface area is 1.4g / m2 2 , tap density 3.2g / cm 3 ; The thermoplastic resin is a flexible polyester resin; the thermosetting resin is an epoxy resin with an epoxy equivalent of 800-1100; the curing agent is 2-ethyl-4-methylimidazole; the auxiliary agent is fumed silica; The percentages are 16% dimethyl succinate, 48% dimethyl glutarate, 16% dimethyl adipate, 20% diethylene glycol ether acetate.

[0027] A method for preparing a new fast-curing low-temperature conductive silver paste, comprising the following process steps: Weighing the raw materials according to the mass...

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Abstract

The invention provides a novel rapid solidification low-temperature conductive silver paste and a preparation method therefor, and belongs to the field of electronic paste of information function newmaterials. The conductive silver paste contains the following components by mass percentage: 45-55% of silver powder, 5-12% of thermoplastic resin, 0.5-1% of thermosetting resin, 0.1-0.5% of heat curing agent, 1-2% of an addition agent and 30-45% of a solvent, wherein the sum of the weight percentages of the components is 100%. The prepared conductive silver paste is short in solidification time,and is completely solidified in 1-2 min under the temperature of 150 DEG C. The conductive silver paste is suitable for precise screen printing. The resolution can reach 100*100 microns, the conductive silver paste is 5B after solidification, and the hardness is greater than 2H. The printing thickness is 4-6 microns, the resistance change rate is less than 280% after 10 forwarding and reverse folding times, and the resistivity is less than 3.5*10<-5>ohm*cm.

Description

technical field [0001] The invention relates to a novel fast-curing low-temperature conductive silver paste and a preparation method thereof, in particular to the field of low-temperature fast-curing conductive paste, and belongs to the technical fields of new materials for electronic information functions and electronic packaging. Background technique [0002] Conductive silver paste is a conductive ink with silver powder as the conductive functional phase, which can be screen printed, coated or pad printed on various substrates, and then solidified or sintered to form an electrode film. According to the curing temperature, conductive silver paste can be divided into high-temperature sintered silver paste, medium-temperature sintered silver paste and low-temperature cured silver paste. Among them, the curing temperature of the low-temperature curing silver paste is between 100-200 °C, the curing temperature is relatively low, and the destructive damage to the substrate is s...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 幸七四李文琳黄富春李章炜
Owner SINO PLATINUM METALS CO LTD
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