A kind of low-temperature resistance silver paste, its preparation method and application

A resistance and low temperature technology, applied in the field of low temperature resistance silver paste, can solve the problems of easy falling off, heating lag, disconnection, etc., and achieve the effects of low heating efficiency, fast heating speed and long service life.

Active Publication Date: 2020-05-19
湖南利德电子浆料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This kind of heating element has low electrothermal conversion efficiency and lagging heating, and because the metal foil does not form effective adhesion with the film material, it is prone to fall off, disconnection and other accidents, resulting in short circuit or open circuit of the heating piece, causing safety hazards, and because It has a certain volume and thickness, and has poor bending resistance, so it is not suitable for use in flexible devices such as wearables.

Method used

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Examples

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preparation example Construction

[0032] The present invention provides a method for preparing low-temperature resistance silver paste described in the above technical solution, comprising the following steps:

[0033] Mix the mixed dibasic acid ester, polyester resin, phenoxy resin and adhesion promoter of the model DBE with a mass ratio of 72~75:10~11:10~12:2~8 to obtain an organic binder; Silver powder, carbon powder, titanium dioxide and silicon carbide powder with a mass ratio of 60-70:8-3:28-18:4-9 are mixed to obtain solid powder;

[0034] The solid powder and the organic binder are mixed at a mass ratio of 60-80:20-40, and rolled to obtain a low-temperature resistance silver paste.

[0035] The present invention mixes the mixed dibasic acid ester, polyester resin, phenoxy resin and adhesion promoter of the model DBE with a mass ratio of 72-75:10-11:10-12:2-8 to obtain an organic binder . The mixed dibasic acid ester, polyester resin, phenoxy resin and adhesion promoter of type DBE are preferably mixe...

Embodiment 1

[0044] 1. Prepare flaky silver powder with a particle size of 9-11 μm, nano-scale carbon black powder, rutile-type titanium dioxide with a particle size of less than 2 μm, and silicon carbide powder with a particle size of less than 2 μm in a ratio (weight ratio) of 62:6:27:5. Obtain solid powder;

[0045] 2. The organic binder formula and dissolution process are: high boiling point solvent mixed dibasic acid ester DBE (74%), polyester resin (10%), phenoxy resin (12%), adhesion promoter BYK4512 (4%) ); the dissolution process is to add the components mixed in proportion to the container and place them in a water bath at 55°C for 5 hours, and at the same time use a mechanical stirrer to mix and stir to obtain an organic binder;

[0046] 3. Slurry mixing process: Add solid powder and organic binder into the container at a mass ratio of 68:32, and use a high-speed disperser to stir and disperse at a speed of 500rpm for 5 minutes. Then put it into a three-roll mill for rolling to...

Embodiment 2

[0055] 1. Prepare flake silver powder with a particle size of 9-11 μm, nano-scale carbon black powder, titanium dioxide with a particle size of less than 2 μm, and silicon carbide powder with a particle size of less than 2 μm at a ratio (weight ratio) of 70:3:19:8 to obtain a solid powder.

[0056] 2. The organic binder formula and dissolution process are: high boiling point solvent mixed dibasic acid ester DBE (75%), polyester resin (10%), phenoxy resin (12%), adhesion promoter BYK4512 (3% ). The dissolution process is to add the components mixed in proportion into a container, place them in a water bath at 55° C. for 5 hours, and use a mechanical stirrer to mix and stir at the same time to obtain an organic binder.

[0057] 3. Slurry mixing process: Add solid phase powder and organic binder into the container at a mass ratio of 70:30, and use a high-speed disperser to stir and disperse at a speed of 500rpm for 5 minutes. Then put it into a three-roll mill for rolling to ob...

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PUM

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Abstract

The invention provides a low-temperature resistance silver paste, which comprises solid powder with a mass ratio of 60 to 80 to 20 to 40 and an organic binder, and a preparation method and applicationthereof. The solid powder comprises silver powder and composite inorganic powder; The composite inorganic powder includes carbon powder, titanium dioxide and silicon carbide. The mass ratio of silverpowder, carbon powder, titanium dioxide and silicon carbide powder is 60-70: 8-3: 28-18: 4-9; The organic binder comprises a mixed dibasic ester of a type DBE with a mass ratio of 72 to 75: 10 to 11:10 to 12: 2 to 8, a polyester resin, a phenoxy resin and an adhesion promoter. The silver paste has good adhesion to the thin film substrate, and is suitable for components with high flexibility requirements, and is not easy to break wires. It also has the characteristics of high thermal efficiency, fast heating speed, heat resistance, aging resistance, chemical corrosion resistance and long service life. The silver paste can also be printed according to customer needs into any shape, suitable for different power requirements of the heater device.

Description

technical field [0001] The invention belongs to the technical field of resistance silver paste, and in particular relates to a low-temperature resistance silver paste, a preparation method and application thereof. Background technique [0002] With the improvement of living standards, people need to use heating elements in more and more fields, such as electric heating shoes, electric heating gloves, electric heating clothes, massage chairs, etc. It can heat the film through electrothermal conversion, and then heat the desired item. [0003] Most of the heating elements currently on the market are made of special metal foils into various resistance circuits, which are then sealed between two layers of insulating films to form heating elements. This kind of heating element has low electrothermal conversion efficiency and lagging heating, and because the metal foil does not form effective adhesion with the film material, it is prone to fall off, disconnection and other accide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00H05B3/10
CPCH01B1/22H01B13/00H05B3/10
Inventor 宁天翔刘飘
Owner 湖南利德电子浆料股份有限公司
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