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Adhesive films for multilayer printed wiring boards

A technology of resin film and interlayer insulating layer, applied in multilayer circuit manufacturing, printed circuit components, circuit substrate materials, etc., can solve problems such as inappropriateness, achieve high heat resistance, high insulation reliability, and excellent operability Effect

Active Publication Date: 2021-10-08
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reaction of the cyano group to form a s-triazine ring by thermal curing requires curing for a long time at a high temperature such as 230° C. for 120 minutes or more, so it is used as a multilayer printed wiring board produced by the above-mentioned lamination method. Resin composition for interlaminar insulating layer is not suitable

Method used

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  • Adhesive films for multilayer printed wiring boards
  • Adhesive films for multilayer printed wiring boards
  • Adhesive films for multilayer printed wiring boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0441] As the epoxy resin, 25.8 parts by mass of "NC-3000-H" (manufactured by Nippon Kayaku Co., Ltd., trade name, solid content concentration 100% by mass) which is a biphenyl novolac epoxy resin was blended,

[0442] As a novolak type phenolic resin, 6.3 parts by mass of "PAPS-PN2" (manufactured by Asahi Organic Materials Co., Ltd., trade name, solid content concentration 100% by mass, Mw / Mn=1.17) was blended,

[0443] As an epoxy resin curing agent, 4.9 parts by mass of "LA-1356-60M" (manufactured by DIC Corporation, trade name, solvent: MEK, solid content concentration 60% by mass) as a triazine-modified phenol novolak resin was blended,

[0444] As an inorganic filler, the surface of "SO-C2" (manufactured by Admatechs Co., Ltd., trade name, average particle size; 0.5 μm) is treated with an aminosilane coupling agent, and further dispersed in MEK. 92.9 parts by mass of silicon (solid content concentration 70% by mass),

[0445] As a curing accelerator, 0.026 parts by mass...

Embodiment 2～6、8

[0448] Embodiment 2~6, 8, comparative example 1~4

[0449] In Example 1, except having changed the raw material composition and manufacturing conditions as described in Table 1, it carried out similarly to Example 1, and obtained the adhesive films 2-6, 8-12.

Embodiment 7

[0451] Preparation Resin varnish A prepared in the following steps is applied on PET (manufactured by Teijin DuPont Film Co., Ltd., trade name: G2, film thickness: 50 μm) as a support film so that the film thickness is 10 μm, and dried. A 60 μm thick support film 2 .

[0452] The resin varnish A used above was produced in the following procedure.

[0453] As the epoxy resin, 63.9 parts by mass of "NC-3000-H" (manufactured by Nippon Kayaku Co., Ltd., trade name, solid content concentration 100% by mass) which is a biphenyl novolac epoxy resin was blended,

[0454] As an epoxy resin curing agent, 18.0 parts by mass of "LA-1356-60M" (manufactured by DIC Corporation, trade name, solvent; MEK, solid content concentration 60% by mass) as a triazine-modified phenol novolak resin was blended,

[0455] Blending 15.2 parts by mass of "EXL-2655" (manufactured by Rohm and Haas Electronic Materials Co., Ltd., trade name) as core-shell rubber particles,

[0456] As an inorganic filler, 8....

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Abstract

The present invention provides an adhesive film for a multilayer printed wiring board that is excellent in embedding property of unevenness even when the silica filler is highly filled. The adhesive film is specifically an adhesive film for a multilayer printed wiring board, which has a resin composition layer formed by forming a layer of a resin composition comprising (A ) the dispersion ratio (Mw / Mn) of weight average molecular weight (Mw) and number average molecular weight (Mn) is 1.05~1.8 novolak type phenolic resin, (B) the epoxy resin represented by general formula (1), and (C) Inorganic filler, the average particle size of (C) inorganic filler in the resin composition layer is 0.1 μm or more, and the content of (C) inorganic filler is 20 to 95% by mass in resin solid content.

Description

technical field [0001] The present invention relates to adhesive films for multilayer printed wiring boards. Background technique [0002] In recent years, for multilayer printed wiring boards used in electronic equipment, communication equipment, etc., not only miniaturization, weight reduction, and high-density wiring, but also high-speed calculation processing speeds are strongly required. In response to this demand, as a method of manufacturing multilayer printed wiring boards, attention has been paid to a build-up manufacturing technique in which interlayer insulating layers are alternately deposited on wiring layers of a circuit board. [0003] In the manufacturing technology of the stacking method, as the manufacturing method of the interlayer insulating layer and the wiring layer, the conventional method in the past is to form the wiring by the so-called "subtractive method". The resin composition of the insulating layer (hereinafter also referred to as "resin compo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/10C09J7/20C09J11/04C09J161/06C09J163/00H05K1/03H05K3/46
CPCC09J11/04C09J161/06C09J163/00H05K1/03H05K3/46C09J7/20C09D161/06C09D163/00
Inventor 松浦雅晴富冈健一横岛广幸菅原郁夫铃川乔之笠原彩手塚祐贵
Owner RESONAC CORPORATION
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