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Composite dielectric layer digital microfluidic chip and preparation method thereof

A technology of composite media and digital microfluidics, which is applied in fluid controllers, chemical instruments and methods, laboratory appliances, etc., can solve problems such as high driving voltage, and achieve the goals of reducing driving voltage, simplifying the preparation process, and good compatibility Effect

Inactive Publication Date: 2019-01-01
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Due to the above reasons, the existing digital microfluidic devices usually need to have both a dielectric layer and a hydrophobic layer, a multi-step coating process is required in the preparation process, and a high driving voltage is required when driving

Method used

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  • Composite dielectric layer digital microfluidic chip and preparation method thereof
  • Composite dielectric layer digital microfluidic chip and preparation method thereof
  • Composite dielectric layer digital microfluidic chip and preparation method thereof

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Embodiment Construction

[0031] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0032] The invention adopts the digital microfluidic chip with high dielectric constant nanoparticle / Teflon composite medium layer structure to replace the medium layer and hydrophobic layer of the traditional digital microfluidic chip with the nanoparticle / Teflon composite film, and the composite film has high The equivalent dielectric constant is not limited by the dielectric constant of Teflon, so it can effectively reduce the chip driving voltage. The nanoparticle / Teflon composite film also has hydrophobic properties, and simplifies the two-layer coating process of the dielectric layer and the hydrophobic layer in the preparation of the traditional digital microfluidic chip into a one-layer coating process, which effectively simplifies the digital microfluidic chip. Preparation Process.

[0033] Such as image 3 As shown, the composite dielectric layer ...

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Abstract

The invention discloses a composite dielectric layer digital microfluidic chip and a preparation method thereof, wherein the chip comprises an upper base plate and a lower base plate, the upper base plate comprises an upper substrate, a grounding electrode on the upper substrate, and a hydrophobic layer above the grounding electrode, and the lower base plate comprises a lower substrate, a drivingelectrode on the lower substrate, and a high dielectric constant nanoparticle / Teflon composite film above the driving electrode. According to the present invention, the high dielectric constant nanoparticle / Teflon composite film is used as the dielectric layer in the digital microfluidic device, integrates the functions of the dielectric layer and the hydrophobic layer, can simultaneously provideeffects of insulation and hydrophobicity, and further can significantly reduce the driving voltage of the digital microfluidic chip and the complexity of the preparation process.

Description

technical field [0001] The invention belongs to the technical field of digital microfluidics, and in particular relates to a composite medium layer digital microfluidics chip and a preparation method thereof. Background technique [0002] Digital microfluidics is a fluid control technology that uses independent droplets as control units. In recent years, biochemical detection chips based on digital microfluidics have been extensively studied. In the application of Lab-on-a-Chip, the droplets on the chip are used as functional media and realize various fluid manipulations, including droplet transport, splitting, merging, and dispensing. [0003] The digital microfluidic chip uses the electrowetting mechanism to realize the on-chip driving of droplets. The electric field driving method based on the electrowetting mechanism has great control flexibility due to the use of direct program control. Commonly used digital microfluidic chips have a parallel double-substrate structur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00
CPCB01L3/502707B01L3/50273B01L3/502784B01L2300/0887B01L2300/12B01L2300/165B01L2400/0427
Inventor 王伟强牛嘉琦
Owner NANJING UNIV OF SCI & TECH
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