Chip-like silicon particles used in the cathode of lithium batteries
A lithium battery and sheet-like technology, applied in the field of silicon material preparation, can solve the problems such as the inability to recycle waste, pulverization, and collapse of the silicon anode structure, and achieve the effects of realizing reuse, reducing side reactions, and alleviating volume effects.
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Embodiment 1
[0030] The method for preparing lithium battery negative electrode material by diamond wire cutting waste silicon powder comprises the following steps:
[0031] 1) Remove the collected crystalline silicon diamond wire cutting waste silicon powder from metal, polyethylene glycol, glue, glass and other impurities remaining in the crystalline silicon diamond wire cutting waste silicon powder.
[0032] 2) Prepare mixed solution: use 0.3mol / L hydrochloric acid, 40% sulfuric acid and 45% nitric acid to prepare a mixed solution, wherein the volume ratio of hydrochloric acid, sulfuric acid, and nitric acid is 1:0.8:1; The temperature is 80°C.
[0033] 3) Soak diamond wire cutting waste silicon powder in the mixed solution for 6 hours with vacuum stirring to remove metal copper, iron, nickel plasma and at the same time conduct preliminary corrosion on the surface of diamond wire cutting waste silicon powder particles, and then use Rinse 5 to 20 times with DI water and ethanol mixture ...
Embodiment 2
[0041] The preparation method of the silicon particles is the same as that in Example 1. The silicon particles include a flaky elemental silicon inner core 1, and the upper and lower surfaces of the flaky elemental silicon inner core 1 have a silicon oxide outer layer 2. The silicon oxide outer layer A plurality of holes 3 are distributed through the layer 2 . The thickness of the flaky silicon particles is 50 nm. The thickness ratio of the elemental silicon inner core 1 to the silicon oxide outer layer 2 is 2.5:1.
Embodiment 3
[0043]The preparation method of the silicon particles is the same as that in Example 1. The silicon particles include a flaky elemental silicon inner core 1, and the upper and lower surfaces of the flaky elemental silicon inner core 1 have a silicon oxide outer layer 2. The silicon oxide outer layer A plurality of holes 3 are distributed through the layer 2 . The thickness of the flaky silicon particles is 30nm. The thickness ratio of the elemental silicon inner core 1 to the silicon oxide outer layer 2 is 2:1. A plurality of holes 3 are uniformly distributed in the silicon oxide outer layer 2 .
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