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Optical sensing module and manufacturing method thereof

A technology of optical sensing and sensing modules, applied in the field of optical sensors, can solve the problems of high processing cost and large overall thickness, and achieve the effects of low cost, reduced thickness and simple assembly

Active Publication Date: 2022-01-28
SHENZHEN GOODIX TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resulting optical module not only has a large overall thickness, but also has high processing costs

Method used

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  • Optical sensing module and manufacturing method thereof
  • Optical sensing module and manufacturing method thereof
  • Optical sensing module and manufacturing method thereof

Examples

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Embodiment Construction

[0037] The technical solutions in the present application embodiment will be described below with reference to the accompanying drawings.

[0038]figure 1 A optical sensing module 100 is presented in the present application embodiment, below figure 1 Description for example. figure 1 A schematic diagram of an optical sensing module 100 in accordance with the present application example is shown. figure 1 The first map is a top view of the optical sensing module 100, a cross-sectional view of a cross section of the A1-A2 in the horizontal direction as shown in the first map. like figure 1 As shown, the optical sensing module 100 includes: PCB 110, an optical sensing chip 120, and an optical assembly 130. Specifically, the lower surface of the PCB 110 is provided with a first recessed groove 111, and the upper surface of the PCB 110 is provided with a first through hole 112 between the first groove 111; the optical sensing chip 120 is located in the first The groove 111 is electrica...

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Abstract

The embodiments of the present application relate to an optical sensing module and a manufacturing method thereof. The optical sensing module includes a printed circuit board PCB (110), an optical sensing chip (120) and an optical assembly (130), the lower surface of the PCB (110) is provided with a first groove (111), and the PCB ( 110) A first through hole (112) is provided between the upper surface and the first groove (111); the optical sensor chip (120) is located in the first groove (111) and connected to the PCB (110) Electrically connected, the optical sensor chip (120) exposes the optical signal receiving area (121) to the upper surface of the PCB through the first through hole (112); the optical component (130) is arranged in the first through hole (112) on and cover the optical signal receiving area (121). The optical sensing module and the manufacturing method thereof in the embodiments of the present application can effectively reduce the thickness of the optical sensing module.

Description

Technical field [0001] The present application relates to the field of optical sensors, and more particularly to an optical sensing module and a method of making it. Background technique [0002] In recent years, various types of consumer electrons have integrated more and more optical sensors. Ambient light intensity detection, distance detection, temperature detection, cym detection, face, fingerprint, iris, etc. can be achieved by means of optical sensors, mobile phones, and watches. [0003] The working principle of the optical sensor is to receive the light of the particular wavelength of the object emitted or reflected by the receiving area of ​​the chip, and convert the optical signal into an electrical signal using the photoelectric effect. A simple optical sensing module requires at least three parts: an optical component (lens, filter, etc.) for forming an optical path and filtering invalid optical signal, for receiving an effective optical signal to achieve optoelectro...

Claims

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Application Information

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IPC IPC(8): H01L23/13H05K1/18H05K3/30
CPCH05K1/182H05K3/30H05K2201/10121
Inventor 陆斌沈健
Owner SHENZHEN GOODIX TECH CO LTD