A wedge-shaped substrate grinding device and its working method

Abstract

The invention discloses a wedge-shaped substrate grinding device and a working method thereof. The wedge-shaped substrate grinding device comprises a scale plate, a counterweight weight, eddy currentsensors, a vacuum suction tube and a ceramic sucker; the number of the eddy current sensors is three, and the three eddy current sensors form an on-line detection unit; and the counterweight weight isfixed on the scale plate through a bolt, the position to fix the counterweight weight on the scale plate is adjusted according to the counterweight requirement, and the counterweight weight forms a pallet-borne counterweight unit. According to the wedge-shaped substrate grinding device, an integrated structure composed of the on-line detection unit and the pallet-borne counterweight unit is adopted, so that the substrate thickness on-line detection and the counterweight adjustment can be completed on one device, and the wedge corner machining of the substrate can be completed without an external-connected thickness detection and counterweight adjustment device; the wedge-shaped substrate grinding device has the characteristics of concise structure, excellent performance, easy, convenientand rapid operation and the like. According to the wedge-shaped substrate grinding device, the problem that the wedge-shaped substrate wedge corner is difficult to machine due to too small angle is solved, the wedge-shaped substrate wedge corner grinding machining precision is improved, and the dependence on operators is reduced.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision machining of wedge-shaped substrates, and in particular relates to a grinding device and a working method thereof for ultra-precision machining of wedge angles of optical materials such as laser wafers and optical glass. Background technique [0002] The wedge-shaped substrate is an optical substrate with a wedge-shaped angle, which uses the refraction of the wedge angle to achieve the deflection of the optical path, allowing the incident beam to change the propagation direction, thereby eliminating the influence of the bottom surface reflection (ghost) of the vertically incident light . Wedge-shaped substrates are mainly used as beam splitters and laser mirrors. Due to their high precision and large degrees of freedom, they are successively used in satellite laser communication systems, tracking and guidance systems, and mode-locked lasers. [0003] In order to achieve the above applicat...

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Problems solved by technology

[0004] In order to overcome the deficiencies of the above-mentioned prior art, the present invention provides a wedge-shaped substrate grinding device and its working method to solve the problem that the wedge-shaped substrate is difficult to process because the angle is too small during the process of wedge-angle processing.

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