Fluorescent chip and its manufacturing method
A fluorescent and chip technology, used in lasers, laser parts, semiconductor lasers, etc., can solve problems such as restricting the development and promotion of new display systems, increasing enterprise costs, and technological stagnation, achieving strong adhesion performance, improving processing efficiency, and avoiding problems. color mixing effect
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Embodiment 1
[0028] figure 1 The specific structure of the fluorescent pixel chip 100 according to the first embodiment of the present invention is shown. figure 2 A top view of the fluorescent pixel chip 100 is shown. exist figure 1 Among them, the fluorescent pixel chip 100 can receive the excitation light incident from directly above it. Here, a blue laser can be selected as the excitation light, and the preferred blue laser can be a laser with a wavelength of 473 nm, such as a laser obtained from a solid-state laser or a semiconductor laser.
[0029] Such as figure 1 As shown, the fluorescent pixel chip 100 includes a substrate 101 , a first reflective layer 102 on the substrate 101 , and a second reflective layer 103 laminated on the first reflective layer 102 .
[0030] The substrate 101 may be one of high thermal conductivity ceramics or single crystal substrates such as aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, etc., preferably an aluminum n...
Embodiment 2
[0043] image 3 An example of another fluorescent pixel chip 200 according to the present invention is shown.
[0044] exist image 3 Among them, the relative positions of the substrate 201, the first reflective layer 202, and the second reflective layer 203 are the same as those of the fluorescent pixel chip 100 in Embodiment 1. In the second reflective layer 203 of the fluorescent pixel chip 200, the light-emitting unit 204 is embedded in the first In the second reflective layer 203 , its upper surface is exposed from the upper surface of the second reflective layer 203 , the difference is that its upper surface is lower than the upper surface of the second reflective layer 203 .
[0045] Since the upper surface of the second reflective layer 203 is higher than the upper surface of the light-emitting units 204, the second reflective layer 203 can better isolate the fluorescence or reflected light of each color emitted by each light-emitting unit 204, further avoiding the oc...
example 1
[0062] Below, will combine Figure 5 The method for manufacturing the fluorescent pixel chip 100 of the present invention will be described in detail.
[0063] Figure 5 It is an explanatory diagram of the method of manufacturing the fluorescent pixel chip 100 of the present invention.
[0064] First, in step a, the substrate 101 is prepared. The substrate 101 may be one of high thermal conductivity ceramics or single crystal substrates such as aluminum nitride, aluminum oxide, silicon carbide, silicon nitride, sapphire, etc., preferably an aluminum nitride ceramic substrate. The thickness of the substrate 101 can be set according to the specific usage requirements of the sample, preferably 0.35-2mm. The length and width of the substrate 101 can be set as required, and here a substrate with a size of 10×10 mm is taken as an example.
[0065] In step b, the first reflective layer 102 is prepared on the substrate 101 . The highly reflective particles including the reflectiv...
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Abstract
Description
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Application Information
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