Device and process for controlling heating temperature field to purify and prepare polycrystalline silicon
A technology of polysilicon and temperature field, which is applied in the direction of polycrystalline material growth, crystal growth, single crystal growth, etc., can solve the problems of unfavorable columnar crystal growth, discontinuous control of temperature field, etc., achieve good cooling effect, ensure cooling effect, improve The effect of heat transfer efficiency
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Embodiment 1
[0049] This embodiment provides a device for purifying and preparing polysilicon by controlling the heating temperature field, which includes a furnace body 2, and a heat insulation board 3 is arranged inside the furnace body 2, and a through hole is opened in the middle of the heat insulation board 3 for accommodating the cooling plate 1. A crucible 4 is placed on the cooling plate 1, and the crucible 4 is provided with a heating induction coil 5 and a thermal insulation cylinder 6. The thermal insulation cylinder 6 is provided with an upper graphite heating ring 7, a middle graphite heating ring 8 and a lower graphite heating ring 9, and the upper graphite heating ring Connecting rings 10 are provided between the graphite heating ring 7 and the middle graphite heating ring 8, and between the middle graphite heating ring 8 and the lower graphite heating ring 9. Made of high temperature resistant material. The connection of the upper section graphite heating ring 7, the middle...
Embodiment 2
[0051] Further improvement on the basis of Example 1, the connecting ring is made of zirconia ceramics or alumina ceramics, and several through holes 11 are provided on the side wall of the connecting ring 10 . The inner bottom of the heat preservation cylinder 6 is provided with a limiting ring plate 12, the inner diameter of the limiting ring plate 12 is smaller than the inner diameters of the upper graphite heating ring 7, the middle graphite heating ring 8, the lower graphite heating ring 9 and the connecting ring 10.
Embodiment 3
[0053] Further improvement on the basis of Example 2, the cooling plate 1 includes a cylindrical shell 101, the shell 101 is provided with a gas distribution sleeve I102 and a gas distribution sleeve П103 of the coaxial center line, the gas distribution sleeve The sleeve П103 is sleeved outside the gas distribution sleeve I102; the outer diameter of the gas distribution sleeve П103 is smaller than the inner diameter of the housing 101, and the inner diameter of the gas distribution sleeve П103 is larger than the outer diameter of the gas distribution sleeve I102;
[0054] The inside of the gas distribution sleeve I102 and the gas distribution sleeve П103 are both ring-shaped hollow chamber structures, and the inner wall of the gas distribution sleeve П103 and the outer wall of the gas distribution sleeve I102 are provided with ventilation holes 104;
[0055] The bottom of the housing 101 is provided with an annular air inlet chamber 105 along the circumference, the air inlet ch...
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