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Lead-free solder alloy and preparation method thereof

A lead-free solder alloy and solder powder technology, applied in the field of alloys

Inactive Publication Date: 2019-01-25
长沙浩然医疗科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to provide a lead-free solder alloy and its preparation method to solve the problem disclosed in the Chinese patent application document "A Sn-Zn-Bi lead-free solder alloy and its preparation method (patent number: 201610446314.3)" Based on this, how to optimize the composition, dosage, process, etc., to improve the wettability of lead-free solder alloys

Method used

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preparation example Construction

[0029] The present invention also provides a preparation method of lead-free solder alloy, comprising the following steps:

[0030] S1: Put the proportionally weighed pure Sn ingot in the smelting furnace, and feed high-purity N 2 protective gas;

[0031] S2: The melting furnace is heated up to 460-500°C, after the pure Sn ingot is completely melted, add pure Zn, pure Bi and pure In, and keep it for 1h;

[0032] S3: adding pure Ti into the molten alloy liquid, raising the temperature to 680°C-720°C and stirring, keeping the temperature for 15-20min, the pure Ti is in the shape of a rod or a sheet;

[0033] S4: After the temperature of the solution drops to 260°C-300°C, add SnNi 4 、SnCe 1.8 , SnGe1 is continuously stirred to make it melt;

[0034] S5: After the smelting is uniform, the slag is removed, and the molten alloy is cast into a solder block or a solder bar, and finally processed into a welding wire, a solder foil or a solder powder.

Embodiment 1

[0036] The lead-free solder alloy includes raw materials in weight percentage: Zn5%, Bi1%, Ti0.5%, In0.003%, Ni0.03%, Ce0.04%, Ge0.05%, and the balance is Sn .

[0037] The present invention also provides a preparation method of lead-free solder alloy, comprising the following steps:

[0038] S1: Put the proportionally weighed pure Sn ingot in the smelting furnace, and feed high-purity N 2 protective gas;

[0039]S2: The melting furnace is heated up to 480°C, after the pure Sn ingot is completely melted, add pure Zn, pure Bi and pure In, and keep it warm for 1h;

[0040] S3: adding pure Ti into the molten alloy liquid, raising the temperature to 720° C. and stirring, and keeping the temperature for 15 minutes. The pure Ti is in the shape of a rod or a sheet;

[0041] S4: After the temperature of the solution drops to 260°C, add SnNi 4 、SnCe 1.8 , SnGe1 is continuously stirred to make it melt;

[0042] S5: After the smelting is uniform, the slag is removed, and the molten...

Embodiment 2

[0044] The lead-free solder alloy includes raw materials in weight percentage: Zn3%, Bi1.5%, Ti1%, In0.001%, Ni0.035%, Ce0.06%, Ge0.06%, and the balance is Sn .

[0045] The present invention also provides a preparation method of lead-free solder alloy, comprising the following steps:

[0046] S1: Put the proportionally weighed pure Sn ingot in the smelting furnace, and feed high-purity N 2 protective gas;

[0047] S2: The melting furnace is heated up to 500°C, after the pure Sn ingot is completely melted, add pure Zn, pure Bi and pure In, and keep it warm for 1 hour;

[0048] S3: adding pure Ti into the molten alloy liquid, raising the temperature to 700°C and stirring, and keeping it warm for 18 minutes, the pure Ti is in the shape of a rod or a sheet;

[0049] S4: After the solution temperature drops to 270°C, add SnNi 4 、SnCe 1.8 , SnGe1 is continuously stirred to make it melt;

[0050] S5: After the smelting is uniform, the slag is removed, and the molten alloy is c...

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Abstract

The invention discloses a lead-free solder alloy and a preparation method thereof, and belongs to the technical field of alloys. The lead-free solder alloy comprises the following raw materials by weight: 3%-5% of Zn, 1%-2% of Bi, 0.5%-1.5% of Ti, 0.001%-0.003% of In, 0.015%-0.035% of Ni, 0.02%-0.06% of Ce, 0.04%-0.06% of Ge and the balance Sn. The wetting property of the lead-free solder alloy isimproved by using a reinforcing system composed of Ni, Ce and Ge.

Description

technical field [0001] The invention belongs to the technical field of alloys, and in particular relates to a lead-free solder alloy and a preparation method thereof. Background technique [0002] With the continuous strengthening of people's awareness of environmental protection, various lead-free solders are rapidly and gradually replacing traditional SnPb solders, which has become an irreversible trend. At present, there are still some problems in the development of new lead-free solders, and the development speed is restricted to a certain extent. At present, the commonly used lead-free solders are mainly based on Sn-Ag, Sn-Zn, and Sn-Bi, and add appropriate amount of other metal elements to form ternary alloys and multi-element alloys. [0003] Sn-Zn solder is currently a lead-free solder that replaces Sn-Pb solder in the electronic packaging industry. Sn-Zn-Bi ternary solder alloy has many advantages, its cost is low, and Bi element can significantly reduce Sn - The ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 不公告发明人
Owner 长沙浩然医疗科技有限公司
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