Slicing auxiliary liquid and slicing method for photovoltaic slices

Abstract

The invention discloses photovoltaic slice separation auxiliary liquid which comprises bubble formation substances and surface lubrication substances. The bubble formation substances are dissolved inwater, the weight ratio of the bubble formation substances ranges from 2% to 15%, the weight ratio of the surface lubrication substances ranges from 0.1% to 2%, the bubble formation substances are attached to the surfaces of photovoltaic slices and decompose bubbles, the surface lubrication substances are used for fixing the bubbles decomposed by the bubble formation substances to the surfaces ofthe photovoltaic slices to form lubrication films containing gas, the buoyancy force of the photovoltaic slices in water can be improved, the separable characteristic of the photovoltaic slices can beimproved, the proportion of slice adhesion and slice connection is decreased, running smoothness of a slice inserter is improved, and the probability of slice breakage and edge damage is reduced. Theinvention further discloses a photovoltaic slice separation method which includes the steps: soaking the degummed photovoltaic slices in the separation auxiliary liquid for preset time; placing the soaked photovoltaic slices into a water tank of the slice inserter and separating the slices.

Description

technical field [0001] The invention belongs to the technical field of photovoltaic slicing, and in particular relates to a slicing auxiliary liquid and a slicing method for photovoltaic slicing. Background technique [0002] At present, in the photovoltaic industry, diamond wire multi-wire cutting has replaced sand wire cutting as the mainstream method of crystalline silicon slicing. This is because diamond wire multi-wire cutting has higher efficiency, less silicon loss, and lower processing costs. [0003] After diamond wire multi-wire cutting, silicon rods are cut into silicon wafers, and cutting fluid sticks on the silicon wafers. The adhesion between silicon wafers and silicon wafers will occur due to the surface tension of water and cutting fluid. At the same time, the cutting of silicon wafers The thickness is getting thinner and thinner, and the crystalline silicon itself is hard and brittle, so it may be subjected to uneven force during the subsequent slicing proce...

AI Technical Summary

Problems solved by technology

A specific embodiment is to forcibly separate the silicon wafers with high adhesion force through the complex pipeline design and the adjustment of the hole shape of the water outlet, using the powerful jet technology in water. Fragments and collapse, another embodiment is by mixing high-pressure gas in the water tank of the inserter, and a large amount of gas dispersed in the water is injected into the stacked silicon wafers together with the water flow to destroy the adhesion between the silicon wafers. Compared with the commonly used Powerful water jet technology, the mixing of gas helps to reduce the friction between silicon wafers, but the gas in the water flow has poor adsorption capacity on the surface of silicon wafers, and the stability is not strong

[0004] To sum up, the powerful water jet method used in the prior art requires precise adjustment of the water flow direction, pressure and speed to ensure the effective separation of the bonded silicon wafers. However, in the actual production process, due to the fluctuation of the performance of the cutting fluid and the uneven residual volume, the There are differences in the adhesion force between the silicon wafers. At the same time, the water quality changes caused by impurities in the sink of the wafer insertion machine make the water flow parameters constantly change, and the friction between the silicon wafers intensifies, which eventually leads to a decrease in the working quality of the wafer insertion machine and damage to the edge of the silicon wafer. Ratio increase

Images