High-barrier composite packaging film
A technology of composite packaging film and packaging film, which is applied in the field of packaging materials, can solve the problems of internal substance pollution, invisible packaging film, poor thermal stability, etc., to improve acceptability, improve identification and operability, and improve shelf life. The effect of life and shelf life
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[0024] Example 1
[0025] A polyester film (SiOx-PET12μm) coated with a silicon oxide nano-film with a thickness of 0.02μm is used as a barrier layer, a cast polypropylene (CPP80μm) with a thickness of 80μm is used as a composite film heat seal layer, and a nylon film with a thickness of 15μm ( PA15μm) as a composite film mechanical strengthening layer. The three layers are compounded together by a dry compounding process, and they are aged in a constant temperature oven at 50°C. After aging for 48 hours, a three-layer silicon oxide high-barrier composite film of PA15μm / SiOx-PET12μm / CPP80μm is obtained. The weight ratio of the glue for dry compounding is: (main agent: curing agent: ethyl acetate) ratio is 5:1:5.8. The amount of glue is 3.5g / m2. The dry composite line speed is 100m / min.
Example Embodiment
[0026] Example 2
[0027] A polyester film (SiOx-PET12μm) coated with a silicon oxide nano-film with a thickness of 0.02μm was used as a barrier layer, and a cast polypropylene (CPP70μm) with a thickness of 70μm was used as a composite film heat seal layer. The two layers are compounded together by a dry compounding process and placed in a constant temperature oven at 50°C for curing. After curing for 48 hours, a SiOx-PET12μm / CPP70μm double-layer silicon oxide high-barrier composite film is obtained. The weight ratio of the glue for dry compounding is: (main agent: curing agent: ethyl acetate) ratio is 5:1:5.8. The amount of glue is 3.5g / m2. The dry composite line speed is 100m / min.
Example Embodiment
[0028] Example 3
[0029] A polyester film (SiOx-PET12μm) coated with a silicon oxide nano-film with a thickness of 0.02μm was used as the barrier layer, and a heat-sealed polyethylene film (PE50μm) with a thickness of 50μm was used as the composite film heat-sealing layer. The two layers are compounded together by a dry compounding process, and they are placed in a constant temperature oven at 50°C for curing. After curing for 48 hours, a SiOx-PET12μm / PE50μm double-layer silicon oxide high-barrier composite film is obtained. The weight ratio of the glue for dry compounding is: (main agent: curing agent: ethyl acetate) ratio is 5:1:5.8. The amount of glue is 3.5g / m2. The dry composite line speed is 100m / min.
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