Acrylate pressure sensitive adhesive and preparation method thereof, and electronic product

A pressure-sensitive adhesive and acrylate technology, applied in adhesives, ester copolymer adhesives, adhesive types, etc., can solve the problem of unsatisfactory high temperature resistance of double-sided adhesives

Active Publication Date: 2019-01-25
GUANGZHOU DUBAGN MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, in the actual use process, due to the large amount of heat generated by electronic components during work, this puts forward higher requirements on the heat resistance of the adhesive. The

Method used

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  • Acrylate pressure sensitive adhesive and preparation method thereof, and electronic product
  • Acrylate pressure sensitive adhesive and preparation method thereof, and electronic product
  • Acrylate pressure sensitive adhesive and preparation method thereof, and electronic product

Examples

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preparation example Construction

[0077] According to the second aspect of the present invention, the present invention provides the preparation method of described acrylate pressure-sensitive adhesive, comprising the following steps:

[0078] (a) Mix 30-35% of the mixed solution and 30-50% of the solvent, heat up to 85-90°C, add 15-25% of the initiator, and react for 25-35min; wherein, the mixed solution is soft Monomer, hard monomer, cross-linking monomer, heat-resistant monomer and tackifying resin are mixed;

[0079] (b) Add 65-75% of the mixed solution, 60-70% of the initiator and 50-70% of the solvent to the solution obtained in step (a) synchronously dropwise, after reacting for 80-100min, add the remaining initiator , After 25-35min, an acrylate pressure-sensitive adhesive was obtained.

[0080]It should be noted that the initiator in the above "adding the remaining initiator" exists in the form of an initiator solution, and the solvent of the initiator solution is the same as that used in the present...

Embodiment 1

[0094] 1. Acrylic pressure sensitive adhesive

[0095] An acrylate pressure-sensitive adhesive, mainly prepared from the following raw materials in parts by weight: the soft monomer is 50 parts of butyl acrylate and 25 parts of isooctyl acrylate; the hard monomer is 20 parts of vinyl acetate and 3 parts of acrylic acid Isobornyl ester; cross-linking monomers are 0.6 parts of acrylamide, 0.1 parts of 1,6-hexanediol diacrylate, 3.2 parts of glycidyl methacrylate, 1.5 parts of hydroxyethyl acrylate and 3 parts of acrylic acid; The body is 5 parts of bismaleimide; the initiator is 0.4 parts of benzoyl peroxide; the tackifying resin is 5 parts of hydrogenated rosin, the solvent is 160 parts of ethyl acetate and the curing agent is 0.6 parts of diisocyanate trimer N3390 .

[0096] 2. Preparation of acrylate pressure-sensitive adhesive

[0097] (1) Mix the soft monomer, hard monomer, cross-linking monomer, heat-resistant monomer and tackifying resin according to the ratio of step 1...

Embodiment 2-7

[0102] The differences between Examples 2-7 and Example 1 are shown in Table 1.

[0103] The difference of table 1 embodiment 2-7 and embodiment 1 soft monomer content

[0104]

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Abstract

The invention provides an acrylate pressure sensitive adhesive and a preparation method thereof, and an electronic product, belonging to the technical field of polymer materials. The acrylate pressuresensitive adhesive is prepared from the following raw materials in parts by weight: 70-80 parts of soft monomer, 18-28 parts of hard monomer, 5-15 parts of crosslinking monomer, 3-7 parts of heat resistant monomer, 0.3-1 part of initiator, 3-6 parts of tackifying resin, and solvent. The acrylate pressure sensitive adhesive obtained by optimizing proportion of each monomer and adding a specific amount of tackifying resin has a high adhesive property and high temperature resistance, has good initial adhesion, peeling force and holding force, better balances all adhesion properties, and can be applied to electronics, electrical appliance, military and aerospace fields having special requirements on high temperature resistance of adhesive.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to an acrylate pressure-sensitive adhesive, a preparation method thereof, and electronic products. Background technique [0002] With the increasing and widening requirements for the performance of double-sided adhesives, in addition to satisfying strong adhesive properties (initial adhesion, peeling force, and holding force, etc.), the adhesive must also be based on different The application has different additional characteristics. For example, the glue pasted on the electronic components needs to have high temperature resistance. Glue with high temperature resistance is required for the pasting of parts (such as fixing electronic components on the circuit board) or the fixing of electronic components on high-density integrated circuits. LED high-power light strips, LED lights, and backlight modules Glue with high temperature resistance is also required for ...

Claims

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Application Information

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IPC IPC(8): C09J133/08C09J11/08C09J7/25C09J7/38C08F220/18C08F218/08C08F220/56C08F222/14C08F220/32C08F220/20C08F220/06C08F222/40
CPCC08F220/18C09J11/08C09J133/26C09J7/255C09J7/385C08F220/1804C08L93/04C08F220/1808C08F218/08C08F220/1811C08F220/56C08F222/102C08F220/325C08F220/20C08F220/06C08F222/40
Inventor 张亚峰刘锐涛林子维臧美星
Owner GUANGZHOU DUBAGN MATERIAL SCI & TECH
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