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PCB-used mark point repairing method

A technology of copper dots and composite sheets, which is applied in printed circuit maintenance/correction, printed circuit secondary treatment, printed circuit parts, etc., can solve the problems of mark point damage, connecting board scrapping, etc., and achieve flat pressure and compact structure , easy to wrinkle effect

Inactive Publication Date: 2019-02-01
双鸿电子(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For the convenience of SMT assembly, the PCB generally adopts the way of connecting boards for shipment. Four corners of the connecting board are placed for position identification mark points on the automatic placement machine, which is convenient for customers to print solder paste and for CCD positioning before the placement machine attaches components. In the PCB manufacturing process, it is inevitable that the mark points will be damaged and other defects. Once one of the marks is damaged, the entire board will be scrapped.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 0.3g / L, wash the composite sheet with deionized water; S 6 : Pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue.

[0027] The light copper sheet ...

Embodiment 2

[0029] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 1.0g / L, wash the composite sheet with deionized water; S 6 : pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue; the plasticizing temperature is 1...

Embodiment 3

[0033] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 1.0g / L, wash the composite sheet with deionized water; S 6 : Pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue; the plasticizing temperature is 1...

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PUM

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Abstract

The invention discloses a PCB-used mark point repairing method. The method comprises the following steps: S1, an art paper sheet and a micro mounted film are laminated through a laminator to form a composite sheet; S2, according to the film for the needed mark point pattern, the laminated composite sheet is developed through a developing solution; S3, the developed composite sheet is etched by using an etching solution; S4, the etched composite sheet is subjected to film stripping through a film stripper, a copper point attached to the micro mounted film is formed, and the composite sheet is cleaned by using deionized water; S5, a plating solution is sprayed on the surface of the copper point, electroless nickel and gold is applied, the mark point is formed, the plating solution comprisesNi<2+>: 0.082 mol / L and Au: 0.3 to 1.0 g / L, and the composite sheet is cleaned by using deionized water; and S6, the mark point is picked off from the micro mounted film, an adhesive is used to bond the mark point to a to-be-repaired mark point. The mark point is adopted to repair the PCB under panel-size outgoing, the overall yield of the PCB can be enhanced, and particularly for a flexible circuit board which is easy to cockle and whose edge MARK is damaged usually, by adopting the method of the invention, the yield of the FPC can be increased by about 2%.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for repairing mark points for PCBs. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] For the convenience of SMT assembly, the PCB generally adopts the way of connecting boards for shipment. Four corners of the connecting board are placed for position identification mark points on the automatic placement machine, which is convenient for customers to print solder paste and for CCD positioning before the placement machine attaches components. In the PCB manufacturing process, it is inevitable that the mark points will be damaged and other defects. Once on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/22
CPCH05K1/0266H05K3/225H05K2203/171
Inventor 舒良陈江波陈惠
Owner 双鸿电子(惠州)有限公司
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