PCB-used mark point repairing method
A technology of copper dots and composite sheets, which is applied in printed circuit maintenance/correction, printed circuit secondary treatment, printed circuit parts, etc., can solve the problems of mark point damage, connecting board scrapping, etc., and achieve flat pressure and compact structure , easy to wrinkle effect
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Embodiment 1
[0026] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 0.3g / L, wash the composite sheet with deionized water; S 6 : Pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue.
[0027] The light copper sheet ...
Embodiment 2
[0029] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 1.0g / L, wash the composite sheet with deionized water; S 6 : pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue; the plasticizing temperature is 1...
Embodiment 3
[0033] The present embodiment provides a kind of PCB mark point repairing method, comprises the following steps: S 1 : Plastic the bare copper sheet and the micro-adhesive film through a plastic machine to form a composite sheet; S 2 : According to the film with the desired mark point pattern, the overmolded composite sheet is developed by a developer; S 3 : the composite sheet after development is etched with etching solution; S 4 : the composite sheet after etching is moved back with the film-removing solution to form copper dots adhered to the micro-sticking film, and the composite sheet is cleaned with deionized water; S 5 : Spray and liquefy nickel gold on the surface of the copper point to form a mark point, and the plating solution includes (Ni 2+ : 0.082mol / L, Au: 1.0g / L, wash the composite sheet with deionized water; S 6 : Pick the mark point from the micro-mucosa, and glue the mark point to the mark point to be repaired with glue; the plasticizing temperature is 1...
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