A fingerprint sensing device and a method of manufacturing the same

Abstract

A panel identification technique is provided, A fingerprint sensing device and a manufacturing method thereof are particularly disclosed. The device comprises a pixel substrate on which a plurality ofsensing pixel units are formed. Each sensing pixel unit has an identification region and a reading region. Each sensing pixel unit includes a patterned light shielding layer arranged in the identification region and the reading region. A polysilicon layer arranged on the patterned light shielding layer; A gate layer arranged on the polysilicon layer in the reading region; A patterned dielectric layer arranged on the gate layer in the read region; A metal oxide layer arranged on the polysilicon layer in the identification region; And a source-drain metal film layer arranged on the metal oxidelayer in the identification region and on the patterned dielectric layer in the reading region, thereby achieving the beneficial effect of no complicated film formation and photolithography process and high resolution. A method of manufacturing the fingerprint sensing device is also provided.

Description

technical field [0001] The present disclosure relates to the technical field of panel identification, in particular to a fingerprint sensing device and a manufacturing method thereof. Background technique [0002] Fingerprint recognition as a biometric method has attracted widespread attention recently, especially in mobile payment, which has broad prospects. Existing methods for fingerprint identification also include optical, capacitive, microwave, temperature and ultrasonic methods. However, the traditional optical sensor method cannot be thin and light, especially under the requirement of high resolution. Traditional devices are bulky and cannot be portable, so it is difficult to integrate them into devices such as mobile phones. Although other methods solve the problem of lightness and thinness, they cannot realize large-area arrays, or cannot combine other functions, and the process is complicated and the cost is high. [0003] The medical amorphous silicon flat pane...

AI Technical Summary

Problems solved by technology

Wherein the first light-shielding layer 2 is on the same metal layer as the gate of the thin film transistor 3, and the drain electrode layer 5 is on the same metal layer as the drain of the thin film transistor 3, thus figure 1 It can be seen from the figure that the main part of this amorphous silicon photodiode is the laminated structure of P-type layer 8, intermediate layer 7 and N-type layer 6, therefore, the thickness of the amorphous silicon flat panel detector is about 3 The thickness of the drain electrode of the amorphous silicon photodiode is superimposed on the laminate thickness of the amorphous silicon photodiode, and the thickness of the intermediate layer 7 in the amorphous silicon photodiode is about 1 micron, so that the thickness of the amorphous silicon flat panel detector is relatively large, and the incident The optical path of light in the pixel unit of the flat panel detector is long, and it may enter the adjacent pixel unit and cause interference

And the flat panel detector pixel unit includes a discrete thin film transistor 3 and an amorphous silicon photodiode, and the thin film transistor 3 and the amorphous silicon photodiode are separately arranged, that is, there is an A certain distance makes the area occupied by the pixel unit of the flat panel detector larger, which in turn makes the resolution lower

In addition, the amorphous silicon photodiode needs to be fabricated separately after the formation of the thin film transistor 3, which requires multiple steps of film formation and photolithography, making the production cost relatively high

If this kind of amorphous silicon flat-panel detector is used in fields such as fingerprint recognition, it will have the defects of high production cost and low resolution, which will limit its application in mobile phones and other portable devices.

[0004] Therefore, it is necessary to provide a fingerprint sensing device and its manufacturing method to solve the defects of high production cost and low resolution in the prior art.

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