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A method for preparing silicon carbide chemical mechanical polishing fluid with improved pH stability

A chemical machinery and polishing liquid technology, applied in polishing compositions containing abrasives, etc., can solve the problems of uncontrolled pH value, low polishing efficiency of silicon carbide, low abrasive hardness, etc., to reduce hard agglomeration and enhance uniform dispersion. Properties and stability, dispersion stability, uniform dispersion effect

Active Publication Date: 2019-12-03
SICC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The CMP polishing liquid of ASAHI GLASS company uses potassium permanganate as the oxidizing agent and acidic silicon oxide or cerium oxide as the abrasive. During the use of the polishing liquid, the pH value cannot be controlled, and the abrasive hardness is low. Therefore, the CMP polishing liquid of ASAHI GLASS company The polishing efficiency of silicon carbide is low

Method used

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  • A method for preparing silicon carbide chemical mechanical polishing fluid with improved pH stability
  • A method for preparing silicon carbide chemical mechanical polishing fluid with improved pH stability
  • A method for preparing silicon carbide chemical mechanical polishing fluid with improved pH stability

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Embodiment 1

[0055] Embodiment 1: Preparation method of silicon carbide chemical mechanical polishing fluid with stable pH value

[0056] A preparation method of a silicon carbide chemical mechanical polishing fluid with stable pH value, the preparation method comprising the following steps:

[0057] (1) Provide an acidic alumina dispersion: disperse 15 grams of alumina powder with a particle size of 100 nm in 100 ml of water, adjust the pH value to 0 to 1 with nitric acid, and grind for 4 to 6 hours with a star ball mill to obtain Acidic alumina dispersion with a pH value of 3.5;

[0058] (2) Surface modification: Add 0.5% of surface modifier organic acid (based on the weight of alumina) to 100ml of the above-mentioned acidic alumina dispersion, and continue to disperse with a ball mill to obtain a surface-modified acidic alumina dispersion;

[0059] (3) Dilute the surface-modified alumina dispersion to 0.5-2%, add nitric acid to adjust the pH to 3.5-4, add 0.05% of a pH stabilizer alumi...

Embodiment 2

[0061] Embodiment 2: Preparation method of silicon carbide chemical mechanical polishing fluid with stable pH value

[0062] A preparation method of a silicon carbide chemical mechanical polishing fluid with stable pH value, the preparation method comprising the following steps:

[0063] (1) Provide an acidic alumina dispersion: disperse 25 grams of alumina powder with a particle size of 100 nm in 100 ml of water, adjust the pH value to 0 to 1 with nitric acid, and grind for 4 to 6 hours with a star ball mill to obtain Acidic alumina dispersion with a pH value of 4.0;

[0064] (2) Surface modification: Add 2.0% of surface modifier organic acid (based on the weight of alumina) to 100ml of the above-mentioned acidic alumina dispersion, and continue to disperse with a ball mill to obtain a surface-modified acidic alumina dispersion;

[0065] (3) Dilute the surface-modified alumina dispersion to 0.5-2%, add nitric acid to adjust the pH to 3.5-4, add 1.0% of pH stabilizer aluminum...

Embodiment 3

[0067] Embodiment 3: Preparation method of silicon carbide chemical mechanical polishing fluid with stable pH value

[0068] A preparation method of a silicon carbide chemical mechanical polishing fluid with stable pH value, the preparation method comprising the following steps:

[0069] (1) Provide an acidic alumina dispersion: disperse 20 grams of alumina powder with a particle size of 100 nm in 100 ml of water, adjust the pH value to 0 to 1 with nitric acid, and grind for 4 to 6 hours with a star ball mill to obtain Acidic alumina dispersion with a pH value of 3.8;

[0070] (2) Surface modification: Add 1.0% of surface modifier organic acid (based on the weight of alumina) to 100ml of the above-mentioned acidic alumina dispersion, and continue to disperse with a ball mill to obtain a surface-modified acidic alumina dispersion;

[0071] (3) Dilute the surface-modified alumina dispersion to 0.5-2%, add nitric acid to adjust the pH to 3.5-4, add 0.08% of pH stabilizer aluminu...

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Abstract

The invention provides a method for preparing a silicon carbide chemical mechanical polishing solution with improved pH stability. The preparation method comprises the following steps: performing surface modification on a high-hardness grinding material dispersion solution by using a surface modifier, and successively adding a pH stabilizer and an oxidant, wherein the surface modifier is organic acid. The stability of the pH value of the polishing solution can be well kept in the chemical mechanical polishing process, and the polishing solution is good in dispersion stability and uniform in dispersion. Since the pH stabilizer is added into the preparation method of the polishing solution, the pH value stability of the polishing solution in the chemical mechanical polishing process is higher, the organic acid surface modifier in the polishing solution is used for performing the surface modification on the high-hardness grinding material dispersion solution, so that the polishing solution is unlikely to have hard agglomeration. The polishing solution of the invention is pollution-free to the environment, and can be used in a circular feeding way.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a method for preparing a silicon carbide chemical mechanical polishing liquid with improved pH stability. Background technique [0002] Due to the high hardness (9.5) and strong chemical inertness of silicon carbide, the polishing speed of alkaline hydrogen peroxide-silicon oxide CMP polishing fluid is very low (<50nm / hr), for two reasons: one is the hardness of silicon oxide Small (6-7); Second, the chemical action of the oxidizing agent is weak under alkaline conditions. Therefore, the use of α-Al whose hardness is second only to silicon carbide 2 o 3 The acidic (pH<7, especially pH<4) silicon carbide chemical mechanical polishing fluid of the abrasive has become the mainstream. [0003] In order to improve chemical oxidation, potassium permanganate has become the most widely used oxidant, but potassium permanganate will consume H during the ox...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 窦文涛宗艳民梁庆瑞王含冠其他发明人请求不公开姓名
Owner SICC CO LTD
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