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A kind of medium temperature curing high toughness epoxy resin and preparation method thereof

An epoxy resin, high toughness technology, applied in the field of advanced polymer material science, can solve the problems of being unsuitable for large-scale production, cumbersome steps, strict preparation requirements, etc., to achieve the effect of improving the curing reaction rate and low viscosity

Active Publication Date: 2021-03-23
广州恒峰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current methods for preparing hyperbranched polymers generally have strict preparation requirements, cumbersome steps, a large amount of organic solvents and catalysts, and are not suitable for large-scale commercial production.

Method used

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  • A kind of medium temperature curing high toughness epoxy resin and preparation method thereof
  • A kind of medium temperature curing high toughness epoxy resin and preparation method thereof
  • A kind of medium temperature curing high toughness epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Mix 85 parts of bisphenol A epoxy resin and 65 parts of acid anhydride curing agent, and stir at 60°C for 20 minutes to prepare a resin prepolymer. Then, add 15 parts of hyperbranched polysiloxane to the above prepolymer, stir for 10 minutes, pour into a mold that has been preheated at 70°C, and vacuumize to remove air bubbles in a vacuum box at 70°C. Blast drying oven for staged temperature rise curing, the curing process is 80°C / 2h+120°C / 3h, cooling, demoulding, and post-treatment at 150°C for 2h.

Embodiment 2

[0040] Mix 90 parts of bisphenol A epoxy resin and 70 parts of acid anhydride curing agent, and stir at 60°C for 20 minutes to prepare a resin prepolymer. Then, add 10 parts of hyperbranched polysiloxane into the above prepolymer, stir for 10 minutes, pour into a mold that has been preheated at 70°C, and vacuumize to remove air bubbles in a vacuum box at 70°C, and put Blast drying oven for staged temperature rise curing, the curing process is 80°C / 2h+120°C / 3h, cooling, demoulding, and post-treatment at 150°C for 2h.

Embodiment 3

[0042] Mix 95 parts of bisphenol A epoxy resin and 75 parts of anhydride curing agent, stir at 60°C for 20 minutes, and prepare a resin prepolymer. Then, add 5 parts of hyperbranched polysiloxane to the above prepolymer, stir for 10 minutes, pour into a mold that has been preheated at 70°C, and vacuumize to remove air bubbles in a vacuum box at 70°C. Blast drying oven for staged temperature rise curing, the curing process is 80°C / 2h+120°C / 3h, cooling, demoulding, and post-treatment at 150°C for 2h.

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Abstract

The invention relates to a moderate-temperature-curing high-toughness epoxy resin and a preparation method thereof. The moderate-temperature-curing high-toughness epoxy resin is characterized by comprising, by mass, 1 to 15 parts of tertiary amine-containing hydroxyl-terminated hyperbranched polysiloxane, 85 to 100 parts of bisphenol A type epoxy resin and 65 to 80 parts of an acid anhydride curing agent. The resin has the characteristics of low curing temperature, good processability, good toughness and the like, and has good application prospects as a resin matrix for electronic packaging materials and structural composite materials in the fields of electronic appliances, vehicles and the like. A curing process for the casting body of the body is composed of curing at 100 DEG C for 2 h,curing at 130 DEG C for 3 h and curing at 150 DEG C for 2 h; and the casting body has impact strength of more than 38.0 KJ / m<2>, bending strength of more than 140 MPa and good thermal stability.

Description

technical field [0001] The invention belongs to the scientific and technical field of advanced polymer materials, and relates to a medium-temperature curing high-toughness epoxy resin and a preparation method thereof. Background technique [0002] As the most common industrial resin matrix material, epoxy resin is widely used in aerospace, electronics industry, automobile manufacturing and other fields due to its excellent mechanical properties, good processing performance, high dimensional stability and solvent resistance. application. However, with the development of science and technology, the technical requirements for products in emerging fields are getting higher and higher. The performance of traditional epoxy resin cured products can no longer meet the requirements, and there are problems such as high brittleness, insufficient toughness, and decreased thermal stability after modification. Need to find new ways to modify it. [0003] At present, the methods for modi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/24
CPCC08G59/245C08L63/00C08L2201/08C08L2203/20C08L83/04
Inventor 颜红侠姚欢欢施勇鹏陈争艳郭留龙
Owner 广州恒峰新材料科技有限公司
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