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Metal mesh-type transparent conductive film manufacturing method using photoresist intaglio pattern and surface modification and transparent conductive film manufactured thereby

A technology of transparent conductive film and manufacturing method, which is applied in the photolithographic process of patterned surface, semiconductor/solid device manufacturing, and final product manufacturing, etc., which can solve the difficulty of controlling wet etching process, and it is difficult to realize fine line width and fine pattern Difficulty and other issues to achieve the effect of improving process complexity, reducing visibility, and reducing defect rate

Inactive Publication Date: 2019-03-01
HIGH END TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At this time, the metal film layer with a thickness of more than several microns is not only difficult to achieve a fine line width in the subsequent wet etching process, but also has a great deal of difficulty in completing the wet etching process while ensuring that no residue is left on the substrate. difficulty
[0007] The metal mesh type transparent conductive film disclosed in Registered Patent Publication No. 10-1319943 is patterned by exposure and etching processes after depositing the metal material. There are difficulties in fine patterns in the exposure process and difficulties in controlling the wet etching process

Method used

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  • Metal mesh-type transparent conductive film manufacturing method using photoresist intaglio pattern and surface modification and transparent conductive film manufactured thereby
  • Metal mesh-type transparent conductive film manufacturing method using photoresist intaglio pattern and surface modification and transparent conductive film manufactured thereby
  • Metal mesh-type transparent conductive film manufacturing method using photoresist intaglio pattern and surface modification and transparent conductive film manufactured thereby

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Embodiment Construction

[0043] In the following, the principles of the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, in the process of describing the present invention in detail, if it is considered that the specific description of related disclosed functions or structures hinders the understanding of the present invention, the detailed description will be omitted. In addition, the terms to be used are terms defined according to the functions of the present invention, and differ according to the user's, operator's intention, custom, or the like. Therefore, the definition should be based on the entire content of this specification.

[0044] figure 1 It is a schematic cross-sectional view of a state where a photoresist is attached to a transparent substrate such as a film by wet coating or laminating a photoresist film-type photosensitive film according to an embodiment of the present invention; figure 2 It is a schem...

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Abstract

The present invention relates to a metal mesh-type transparent conductive film manufacturing method using a photoresist intaglio pattern and a surface modification, the method comprising the steps of:(S1) forming a photoresist layer (20) on an upper surface of a substrate (10) or an upper and a lower surface of the substrate (10); (S2) forming, on the photoresist layer (20), an intaglio design part in which an embossed portion (21) and an intaglio portion (22) are arranged in a mesh shape; (S3) depositing a first metal film conductive layer (40) on the intaglio design part of the photoresistlayer (20) or growing a second metal film conductive layer (50) on the first metal film conductive layer (40) deposited on the substrate by a plating process; (S4) modifying a surface of the deposition-completed or plating-completed substrate with dry ice powder; and (S5) removing the embossed portion (22) of the photoresist layer (20). Designed to easily conduct a peeling-off process through surface modification with dry ice, without a wet etch, after formation of a thick metal film conductive layer, the present invention has the effect of alleviating process complexity and reducing a defective proportion. Also, the present invention shows the effect that an upper and a lower low-reflection layer deposited in an intaglio portion greatly reduce visibility and serve as an adhesive layer ina lower part and as a protection layer in an upper part, thereby providing a highly reliable transparent conductive film.

Description

technical field [0001] The invention relates to a method for manufacturing a metal mesh type transparent conductive film, in particular to forming an intaglio pattern using a photoresist on a substrate, and forming a metal mesh structure on the formed intaglio pattern by vapor deposition and plating. Scratches, etc., using a photoresist intaglio pattern and surface modification to facilitate the production of a metal mesh type transparent conductive film and the transparent conductive film produced thereby. Background technique [0002] Recently, with the development of the optical / electronic field, the industrial demand for a transparent conducting film (transparent conducting film) having both high light transmittance and electrical conductivity has gradually increased. Especially as display elements are combined with touch functions for user convenience, transparent conductive films have become important core components and materials for electronic equipment such as flat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/027H01L21/285H01L21/288H01L21/02G03F7/20H01L31/18
CPCC23C28/02C23C28/345C23C28/32H01L31/022491H01L21/0272C25D5/022C25D5/48C23C18/1605C23C18/38C23C18/42C23C18/48C23C18/1689C23C14/14C23C14/042C23C14/024C23C14/046C23C14/588H01L21/0273H01L21/2855H01L21/28506H01L21/288H01L21/02172G03F7/20H01L31/1884H01L21/027H01L31/18H01L21/285H01L21/02Y02P70/50C23C14/021C23C14/58C23C18/165C25D5/02G03F7/427H01L31/022433
Inventor 李锡宰
Owner HIGH END TECH CO LTD