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Scaling powder for high-temperature solder paste and preparation method of scaling powder

A flux, high-temperature welding technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of oxidized solder joints, blackening, flux splashing, etc., to improve color, high activation temperature, and improve weldability Effect

Active Publication Date: 2019-03-19
云南锡业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the solder paste used for soldering of semiconductors with a temperature above 280°C, due to the high soldering temperature, will cause problems such as flux splashing, oxidation, and blackening around the solder joints during the soldering process.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Prepare raw materials according to the following mass ratio:

[0011] Thirty-two carbon diacid 8.0%;

[0012] Stearic acid 1.0%;

[0013] 2,3-Dibromosuccinic acid 1.0%;

[0014] PW-9225 0.5%;

[0015] N-decyl ether 10.0%;

[0016] Glycerol 10%;

[0017] N-octyl ether 15.0%;

[0018] Castor oil 3.5%;

[0019] 6650R 6.0%;

[0020] Polymerized rosin 140 15.0%;

[0021] KE-604 rosin 30.0%.

[0022] Flux for high temperature solder paste is prepared as follows: Put KE-604 rosin and polymerized rosin 140 into a reactor, melt the rosin at 180℃~200℃; mix n-decyl ether, glycerol and n-octyl ether The solvent is slowly added to the molten rosin, the temperature is maintained at 170 ℃ ~ 180 ℃, stirring for 10 minutes, and then add 32 carbon dicarboxylic acid, stearic acid and 2,3-dibromosuccinic acid mixed and formulated activator and high temperature resistance Oxygen agent PW-9225, stir for 10 minutes; then cool the material to 150℃~160℃, finally add castor oil and 6650R mixed thixotropic agen...

Embodiment 2

[0024] Prepare raw materials according to the following mass ratio:

[0025] Thirty-two carbon two acid 5.0%;

[0026] Adipic acid 1.0%;

[0027] Glutaric acid 2.0%;

[0028] PW-9225 1.0%;

[0029] N-decyl ether 20.0%;

[0030] Glycerol 20.0%;

[0031] Castor oil 3.0%;

[0032] 6650R 6.0%;

[0033] Polymerized rosin 120 10.0%;

[0034] Polymerized rosin 140 10.0%;

[0035] KE-604 rosin 22.0%.

[0036] Flux for high temperature solder paste is prepared as follows: Put KE-604 rosin, polymerized rosin 120 and polymerized rosin 140 into a reactor, melt the rosin at 180℃~200℃; mix n-decyl ether and glycerol Slowly add the solvent to the molten rosin, keep the temperature at 170℃~180℃, stir for 12 minutes, and then add the active agent mixed with 32 carbon dicarboxylic acid, adipic acid, glutaric acid and high temperature antioxidant PW-9225, Stir for 8 minutes; then cool the material to 150 ℃ ~ 160 ℃, finally add castor oil and 6650R mixed thixotropic agent, stir for 33 minutes, pour into a glass...

Embodiment 3

[0038] Prepare raw materials according to the following mass ratio:

[0039] Thirty-two carbon dioxide acid 4.5%;

[0040] Azelaic acid 1.0%;

[0041] Sebacic acid 1.0%;

[0042] PW-9225 0.1%;

[0043] N-decyl ether 10.0%;

[0044] N-octyl ether 20.0%;

[0045] Castor oil 2.0%;

[0046] 6650R 8.0%;

[0047] Polymerized rosin 120 18.4%;

[0048] KE-604 rosin 35.0%.

[0049] Flux for high temperature solder paste is prepared as follows: Put KE-604 rosin and polymerized rosin 120 into a reactor, and melt the rosin at 180℃~200℃; slowly add the solvent mixed with n-decyl ether and n-octyl ether to the melt In the rosin, keep the temperature at 170°C~180°C, stir for 8 minutes, then add the active agent mixed with 32 carbon dioxide, azelaic acid and sebacic acid and the high temperature antioxidant PW-9225, and stir for 8 minutes; Then cool the material to 150℃~160℃, finally add castor oil and 6650R mixed thixotropic agent, stir for 27 minutes, pour it into a glass container, and cool to room temp...

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Abstract

The invention discloses scaling powderfor high-temperature solder paste and a preparation method of the scaling powder. The scaling powder is prepared from the raw materials in percentage by weight: 5.0-10.0% of an active agent, 0.1-1.0% of a high-temperature antioxidant, 30.0-40.0% of a dissolvant, 3.0-10.0% of a thixotropic agent, and the balance of a film forming agent. The active agent is dotriacontanedioic acid and one or more of glutaric acid, adipic acid, azelaic acid, sebacic acid, stearic acid, and 2,3-dibromosuccinic acid. The high-temperature antioxidant is PW-9225. The dissolvant is di-n-decyl ether and one or two of glycerol and n-octyl ether. The boiling point of the dissolvant is greater than 280DEG C. The thixotropic agent is a mixture of castor oil and 6650R. The film forming agent is a mixture of KE-604 rosin and polymerized rosin.The scaling powder is high in activity, good in weldability and stability and not liable to splash, oxidation can be avoided, blackening around the welding point can be avoided, and the scaling powder is suitable for high-temperature solder paste products with the temperature above 280DEG C.

Description

Technical field [0001] The invention relates to the technical field of a flux for solder paste and a preparation method thereof. As a flux material of SMT, the flux is suitable for a series of alloy powder solder paste products with a soldering temperature above 280°C. Background technique [0002] Solder paste is mainly used for surface mount technology (SMT) soldering. With the development of electronic information equipment, SMT has become the mainstream technology for electronic assembly, and its usage is increasing. [0003] There are many types of fluxes for solder paste, and their composition ratio and applicability are different. At present, the solder paste used for soldering of semiconductors with a temperature above 280°C, due to the high soldering temperature, will cause problems such as flux spatter, oxidation and blackening around the solder joint during the soldering process. Summary of the invention [0004] The purpose of the present invention is to overcome the fl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/36B23K35/362B23K35/40
Inventor 秦俊虎白海龙武信何欢卢梦迪王艳南刘宝权段雪霖吕金梅张欣沈海斌周建东唐丽朵云琨赵玲彦
Owner 云南锡业新材料有限公司
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