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Soldering process for power semiconductor modules

A technology for power semiconductors and welding processes, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as multiple voids, inability to remove solder oxides, poor welding quality, etc., to simplify the operation process and the welding effect. Good, improve the effect of welding efficiency

Active Publication Date: 2021-08-10
BEIJING SATELLITE MFG FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

First of all, during the soldering process, the reduction process is carried out when the solder is in a solid state, and the oxides in the solder cannot be removed, resulting in poor final soldering quality and more voids

Method used

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  • Soldering process for power semiconductor modules
  • Soldering process for power semiconductor modules
  • Soldering process for power semiconductor modules

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Embodiment Construction

[0031] The present invention greatly changes the existing technological process by analyzing the current welding process and method, so as to improve the void rate of the welding interface and improve the welding production efficiency. The void rate of the solder joint interface is composed of the air bubble rate + debonding rate, that is, the voids at the solder joint interface have debonding caused by non-wetting or inclusions in addition to air bubbles. Flux residue and oxidation are the main factors leading to debonding. The timing of filling the reducing gas formic acid is changed from the original when the solder is solid to when the solder is melted, which can better remove the oxide layer on the solder, and then cooperate with the plasma cleaning before welding Pretreatment to remove oxides to the greatest extent, avoid debonding caused by non-wetting, and reduce interface void ratio. At the same time, this method avoids the four-step process of vacuuming, formic acid...

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Abstract

The welding process for power semiconductor modules includes the following steps: making solder sheets; plasma cleaning; making prefabricated workpieces; exhausting the air in the vacuum furnace; heating the prefabricated workpieces until the solder sheets melt evenly into molten solder; filling formic acid and A mixed gas of nitrogen, and then filled with nitrogen, so that formic acid decomposes H 2 Remove the molten solder, oxides on the surface of the ceramic plate and the bottom plate; vacuumize until the bubbles in the molten solder are fully discharged; backfill nitrogen and cool down, so that the molten solder is cooled and solidified to complete the welding of the power semiconductor module. The welding method of the present invention can complete the deoxidation and welding process at one time, improve the welding efficiency, and at the same time, the deoxidation in the molten state of the solder is more complete, and the welding effect is better, and the plasma cleaning is combined with the atmosphere and vacuum degree control in the welding process to realize Improved welding quality and efficiency.

Description

technical field [0001] The invention relates to a welding process for a power semiconductor module and belongs to the field of welding technology. Background technique [0002] The power semiconductor module is a power electronic module with motor drive capability formed by packaging power devices, control circuits, drive circuits, interface circuits, protection circuits and other chips, using internal wire bonding and substrate interconnection. Due to its characteristics of high current and high power density, high-power modules have more stringent requirements on thermal characteristics and process load than traditional low-power modules and integrated circuits. With the continuous improvement of module power density and transmission current, the operating current of chips and modules is getting larger and larger, the voltage between terminals is gradually increasing, and the input power is increasing, resulting in increasing heat loss. The welding quality of the ceramic ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02
CPCC04B37/023C04B2237/12C04B2237/343C04B2237/407C04B2237/52
Inventor 张峻陈滔孙晓峰李松玲张彬彬陈庆
Owner BEIJING SATELLITE MFG FACTORY
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