Electronic circuit 3D printing method based on FR-4 substrate
An electronic circuit, FR-4 technology, used in printed circuits, printed circuit manufacturing, circuit substrate materials, etc., can solve the problems of poor bonding between conductive circuits and non-metal substrates, and achieve good solderability, high speed, and satisfactory Quickly verify the desired effect
Active Publication Date: 2019-03-29
NO 30 INST OF CHINA ELECTRONIC TECH GRP CORP
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Problems solved by technology
The above-mentioned printing methods are mainly for printing flexible circuits, and the bonding force between conductive circuits and non-metallic substrates is poor. The non-metallic substrate should have good bonding force, which can meet the minimum adhesion of the coating given in GB / T 4677-2002 "Printed Board Test Method" and meet the requirements of relevant standards for thermal stress and temperature shock
Method used
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[0031] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.
[0032] Such as figure 1 Shown, a kind of electronic circuit 3D printing method based on FR-4 substrate, comprises the following steps:
[0033] (1) According to the design requirements, use EDA design software to design electronic circuit graphics (ie figure 1 Circuit diagram PCB files for designing electronic circuits on a computer);
[0034] (2) Convert the PCB file output that adopts the software design used in step (1) into a CAD graphic file, such as DWG, DXF, etc.;
[0035] (3) Determine the printing plan;
[0036] (4) Set the equipment use parameters in the printing equipment control software, set the distance between the needle and the substrate (FR-4 substrate) to 20 μm, set the printing air pressure to 0.2MPa, and set the print...
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Abstract
The invention discloses an electronic circuit 3D printing method based on an FR-4 substrate. The method comprises the following steps: (1) designing a PCB file; (2) outputting the PCB file and converting the PCB file into a CAD graphic file; (3) determining a printing scheme; 4) setting device usage parameters in printing device control software; (5) loading matched conductive paste into a printing needle, and then loading the printing needle loaded with silver paste and silver palladium paste into a printing device; (6) fixing the substrate; (7) starting the device in order that the printingneedle extrudes the conductive paste onto the FR-4 substrate, and moves according to a set path; and (8) after preliminary heating and drying, performing laser sintering. An electronic circuit printedby the method has a promotion value and meets the needs for rapid verification of an electronic product. The method can form various complicated circuit patterns. An electronic circuit board formed by curing the conductive paste by the laser sintering method has good bonding force and satisfies the test requirements for thermal stress, bond strength, temperature shock and the like. The bonding pads mounted after a reflow soldering test have good solderability.
Description
technical field [0001] The invention relates to a 3D printing method of an electronic circuit based on an FR-4 substrate. Background technique [0002] The market competition in the electronics manufacturing industry is becoming increasingly fierce, and realizing rapid product manufacturing and rapid verification of functional indicators has become a sharp weapon to seize the market. The rapid prototyping technology represented by 3D printing has been widely used in the manufacturing industry. Due to its high material utilization rate, fast response speed, and good manufacturability of complex parts, it greatly reduces the development risk and shortens the development time. As far as the rapid manufacturing of complete electronic products is concerned, related metal and non-metal 3D printing technologies are relatively mature and have been widely used in products. As the core component of electronic products, electronic circuits have a relatively late development of 3D prin...
Claims
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IPC IPC(8): H05K3/12H05K1/03H05K1/09
CPCH05K1/0366H05K1/092H05K3/1275H05K3/1283
Inventor 杨伟毛久兵冯晓娟杨平吴圣陶杨剑刘鹏张晓雄刘小伟赵波
Owner NO 30 INST OF CHINA ELECTRONIC TECH GRP CORP