A kind of 3D printing method of electronic circuit based on fr-4 substrate

Abstract

The invention discloses a 3D printing method for an electronic circuit based on an FR-4 substrate, comprising the following steps: (1) designing a PCB file; (2) converting the output of the PCB file into a CAD graphic file; (3) determining the printing scheme; ( 4) Set the equipment use parameters in the printing equipment control software; (5) load the conductive paste that has been prepared into the printing needle, and then load the needle with the silver paste and silver palladium paste into the printing equipment; (6) ) Fix the substrate; (7) Start the equipment, the printing needle extrudes the conductive paste on the FR-4 substrate, and moves according to the set path; (8) After preliminary heating and drying, laser sintering. The electronic circuit formed by the printing of the present invention has more popularization value and meets the needs of rapid verification of electronic products; it can form various complex circuit patterns; the electronic circuit board formed by curing the conductive paste by laser sintering has good bonding force and meets the requirements for thermal stress, Adhesive strength, temperature shock and other tests and assessments, after the reflow test, the solderability of the mounting pad is good.

Description

technical field [0001] The invention relates to a 3D printing method of an electronic circuit based on an FR-4 substrate. Background technique [0002] The market competition in the electronics manufacturing industry is becoming increasingly fierce, and realizing rapid product manufacturing and rapid verification of functional indicators has become a sharp weapon to seize the market. The rapid prototyping technology represented by 3D printing has been widely used in the manufacturing industry. Due to its high material utilization rate, fast response speed, and good manufacturability of complex parts, it greatly reduces the development risk and shortens the development time. As far as the rapid manufacturing of complete electronic products is concerned, related metal and non-metal 3D printing technologies are relatively mature and have been widely used in products. As the core component of electronic products, electronic circuits have a relatively late development of 3D prin...

AI Technical Summary

Problems solved by technology

The above-mentioned printing methods are mainly for printing flexible circuits, and the bonding force between conductive circuits and non-metallic substrates is poor. The non-metallic substrate should have good bonding force, which can meet the minimum adhesion of the coating given in GB / T 4677-2002 "Printed Board Test Method" and meet the requirements of relevant standards for thermal stress and temperature shock

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