Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultra-thin ceramic fingerprint piece grinding technology

A grinding process and ceramic technology, applied in the field of ultra-thin ceramic fingerprint chip grinding equipment and its grinding process, can solve problems such as poor orange peel, broken products, uneven surface, etc., to avoid poor orange peel and scratches, and increase pressure and rotating speed, the effect of product surface uniformity

Inactive Publication Date: 2019-04-02
GUANGDONG JANUS SMART GRP CO LTD
View PDF7 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disadvantages: 1. Due to the thin thickness of the product, the planetary disc (blue steel sheet) used can only be thinner than the product thickness. In order to ensure the strength, only small-diameter planetary gears can be used, which limits the use of large-diameter planetary gears. Every time the product is processed The small quantity affects the processing efficiency; only low-speed and low-pressure processing parameters can be used in the processing process to affect the processing efficiency; it is easy to cause frying (planetary disc deformation damage, product breakage) phenomenon during the processing process, the process is complicated and the processing process is unstable. Affect yield and efficiency
2. Since the zirconia ceramic fingerprint sheet has very high requirements on surface roughness and flatness, there are only a few fixed speed ratios for the revolution and rotation of the planetary wheel during the processing process, which cannot better realize the chaotic and irregular trajectory of the product during movement. Make the surface uneven and rough, prone to waviness
3. In the process of fine polishing, the temperature rises, resulting in poor orange peel on the surface of the product, and causing the silica sol to coagulate too quickly to form hard particles, resulting in poor scratches on the product surface
4. The processing of thinner products (thickness<0.08mm) cannot be realized

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultra-thin ceramic fingerprint piece grinding technology
  • Ultra-thin ceramic fingerprint piece grinding technology
  • Ultra-thin ceramic fingerprint piece grinding technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Process 180 mobile phone fingerprint cover blanks with a diameter of 50mm and a thickness of 0.3mm into finished products with a thickness of 0.05mm. The coarse grinding medium is a mixed solution of 1kg of B4C with a particle size of W9 and polycrystalline diamond powder mixture and 30kg of water; the fine grinding medium is a mixed solution of 4kg of silica sol with a particle size of 120nm and 24kg of water.

[0054] Processing parameters:

[0055]

[0056]

[0057]

[0058] The first pass rate of the product obtained according to the process of this embodiment is 98.3%, and the surface roughness is 2.9nm.

Embodiment 2

[0059] Embodiment 2: 180 cell phone fingerprint cover blanks with a diameter of 50 mm and a thickness of 0.3 mm were processed into a finished product with a thickness of 0.05 mm. The coarse grinding medium is a mixed solution of 2kg of B4C with a particle size of W5 and a mixture of polycrystalline diamond microparticles and 30kg of water; the fine grinding medium is a mixed solution of 5kg of silica sol with a particle size of 50nm and 20kg of water.

[0060] Processing parameters:

[0061]

[0062]

[0063] The first pass rate of the product obtained according to the process of this embodiment is 99.4%, and the surface roughness is 2.1 nm.

Embodiment 3

[0064] Embodiment 3: 180 cell phone fingerprint cover blanks with a diameter of 50 mm and a thickness of 0.3 mm were processed into a finished product with a thickness of 0.05 mm. The grinding (coarse grinding) medium is a mixed solution of 3kg of B4C with a particle size of W7 and a mixture of polycrystalline diamond microparticles and 15kg of water; the polishing (finishing) medium is a mixed solution of 7kg of silica sol with a particle size of 80nm and 21kg of water.

[0065] Processing parameters:

[0066]

[0067]

[0068] The first pass rate of the product obtained according to the process of this embodiment is 98.8%, and the surface roughness is 2.4nm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The invention relates to an ultra-thin ceramic fingerprint piece grinding technology. The ultra-thin ceramic fingerprint piece grinding technology is completed through ultra-thin ceramic fingerprint piece grinding equipment. The ultra-thin ceramic fingerprint piece grinding equipment comprises a rack and further comprises an upper polishing disc, a lower fixing disc, a lifting mechanism, a mediumspaying mechanism, a rotating mechanism and a control box which are mounted on the rack, the upper polishing disc is driven by the lifting mechanism located at the upper part of the rack, and the lower fixing disc is located at the lower part of the upper polishing disc and corresponds to the upper polishing disc; and a plurality of air suction discs with air suction holes are arranged between theupper polishing disc and the lower fixing disc, the lower part of each air suction disc is rotationally mounted on the lower fixing disc through a rotating shaft, and the outer walls of the air suction discs are driven by the rotating mechanism. The ultra-thin ceramic fingerprint piece grinding technology has the advantages that an ultra-thin ceramic fingerprint piece (the thickness is greater than or equal to 0.04 mm and less than 0.08 mm) can be machined efficiently and stably, and mass production is achieved.

Description

technical field [0001] The invention relates to an ultra-thin ceramic fingerprint chip grinding device and a grinding process thereof, which are applicable to the field of grinding and polishing hard and brittle materials such as 0.04-0.3 mm ultra-thin glass, ceramics, silicon crystal, sapphire and the like. Background technique [0002] With the introduction of fingerprint technology in Apple iPhone 5S in 2013, the power-on settings of mobile phones have evolved from the initial digital password and graphic unlocking to the current fingerprint recognition, and our mobile phones have become more and more secure. In just two or three years, a large number of thousand-yuan phones and even hundred-yuan phones have been equipped with fingerprint recognition technology. It can be said that fingerprint recognition has almost become an essential function of mobile phones. The function of fingerprint recognition has also changed from the previous single unlocking to the current func...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B37/10B24B37/30B24B37/34B24B37/12B24B57/02B24B47/12
Inventor 周小辉赵乾
Owner GUANGDONG JANUS SMART GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com