Semiconductor structures and methods of forming them

Abstract

The present invention provides a semiconductor structure and a method for forming the same, wherein the method includes: forming an initial functional layer on a substrate in a first region and a second region; forming an initial mask layer on the initial functional layer; A plurality of discrete first pattern layers are formed on the initial mask layer in one area, and second pattern layers are formed on the initial mask layers in the removal area and the reserved area, respectively. The size of the first pattern layer along the first direction is The first size, the size of the second graphic layer along the first direction is the second size, the second size is equal to the first size, and the distance between adjacent first graphic layers is the same as the adjacent second graphic layer. The spacing between them is equal; a pattern transfer process is performed to form a plurality of mask layers. The forming method can improve the performance of the formed semiconductor structure, and can simplify the process flow.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor structure and a forming method thereof. Background technique [0002] With the rapid development of semiconductor manufacturing technology, semiconductor devices are developing in the direction of high density and high integration. In order to reduce the size of semiconductor devices and improve the integration of semiconductor devices, multiple patterning processes have been developed in the prior art, including double patterning processes, triple patterning processes and quadruple patterning processes. [0003] The double patterning process can effectively reduce the difficulty of making small-size graphics, and has important applications in forming small-size graphics. The double patterning process includes self-aligned double exposure (SADP) technology, double etching double patterning (DEDP) technology and single etching double patterning...

AI Technical Summary

Problems solved by technology

[0004] With the improvement of the integration of semiconductor devices, when the density of patterns in different regions on the same chip is different, the performance of the semiconductor structure formed by the double patterning process is poor

Images