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Solder paste laser-induced forward transfer device and method

A technology of laser induction and transfer equipment, applied in laser welding equipment, welding equipment, welding equipment and other directions, can solve the problems of inability to meet small-scale rapid production, high cost, long cycle, etc., to shorten the production cycle, simplify the production process, The effect of reducing production costs

Active Publication Date: 2019-04-05
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current solder paste printing technology mainly adopts the method of screen printing, and screen printing often needs to make different screens for different PCB boards, which is relatively high in cost and long in cycle, and cannot meet the needs of small-scale rapid production

Method used

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  • Solder paste laser-induced forward transfer device and method
  • Solder paste laser-induced forward transfer device and method
  • Solder paste laser-induced forward transfer device and method

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Embodiment

[0034] Such as Figure 1-4 shown. The invention discloses a solder paste laser-induced forward transfer device, which includes a laser unit and a computer control system 14, and is characterized in that: it also includes a solder paste transfer module; the computer control system 14 controls the laser beam output of the laser unit and the solder paste movement of the paste transfer module;

[0035] The solder paste transfer module includes a transparent substrate 8, a fixture 10, a Z-axis lifting platform 11, a receiving substrate 12, and an XYZ-axis moving platform 13;

[0036] The lower surface of the transparent substrate 8 is a concave surface for accommodating the solder paste film 9; the transparent substrate 8 is quartz glass or other transparent objects.

[0037] The receiving substrate 12 and the Z-axis lifting platform 11 are placed on the XYZ axis moving platform 13 to adjust the relative position of the receiving substrate 12 and the laser beam spot;

[0038] Th...

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Abstract

The invention discloses a solder paste laser-induced forward transfer device and method. The solder paste laser-induced forward transfer device comprises a laser, a light beam shaping module, a lightpath adjusting module, a solder paste transfer module and a computer control system, the laser is connected with the light beam shaping module and is close to the light path adjusting module, and thesolder paste transfer module is located below the light path adjusting module; the light beam shaping module comprises a beam-expanding lens, an aperture, a flat-topped light beam shaper and a space light modulator; the light path adjusting module comprises a two-dimensional galvanometer and an f-theta lens meter; the solder paste transfer module is composed of a transparent substrate, a tin pastefilm, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform; and the computer control system consists of a computer and drivers of other devices. Non-contact high-precision solder paste transferring without masking can be achieved; and the production cycle can be greatly shortened, and the production cost can be lowered.

Description

technical field [0001] The present invention is a process and equipment for realizing solder paste transfer by using laser induced forward transfer technology (Laser induced forward transfer, referred to as LIFT), which belongs to the field of laser application and solder paste printing technology, and in particular relates to a laser induced forward transfer of solder paste Equipment and methods. Background technique [0002] SMT (Surface Mount Technology) is a circuit assembly that mounts non-pin or short-lead surface package components, such as resistors, capacitors, transistors, integrated circuits, etc., on a printed circuit board and forms electrical connections through reflow soldering. technology. Solder paste printing is the first step in the entire SMT process. The current solder paste printing technology mainly adopts the method of screen printing, and screen printing often needs to make different screens for different PCB boards, which is relatively high in cos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B27/09H05K3/34
CPCH05K3/34G02B27/0955B23K1/203B23K1/20B23K3/0638B23K3/08B23K26/0006B23K26/34B23K26/0622B23K26/082B23K26/0648H05K2203/0139H05K2203/107H05K3/3485B23K1/0056G05B15/02H05K3/341
Inventor 张宪民单译琳李凯汤传刚
Owner SOUTH CHINA UNIV OF TECH
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