Anti-adhesion hard coating for injection mold and its preparation method
A hard coating and injection mold technology, which is applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of labor cost and economic cost increase
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Embodiment 1
[0046] First, the mold base is cleaned and dried;
[0047] In the next step, the metal Cr layer (bonding layer) is deposited by magnetron sputtering ion plating: vacuumize to 0.8×10 -3 The vacuum degree is above Pa, and then argon gas (Ar, with a purity of 99.99%) is introduced, the air pressure is controlled at 0.3-0.8pa, the Cr target current is 1.2A, the negative bias voltage is 120V, the bias frequency is 180kHz, and the thickness of the deposited layer is about 2μm.
[0048] In the next step, the CrN layer (transition layer) is deposited by magnetron sputtering ion plating: vacuumize 0.8×10 -3 The vacuum degree is above Pa, and then the nitrogen gas (N 2 , the purity is 99.999%), the air pressure is controlled at 0.8-1.2pa, the Cr target current is 0.6A, the negative bias voltage is 60V, the bias frequency is 60kHz, and the thickness of the deposited layer is about 3 μm.
[0049] In the next step, the (Cr,Ni)N / DLC composite layer is deposited by magnetron sputtering ion...
Embodiment 2
[0055] The cleaning and drying of the mold substrate is the same as in Embodiment 1.
[0056] According to the method of Example 1, a metal Cr layer (bonding layer) is deposited.
[0057] According to the method of Example 1, a CrN layer (transition layer) is deposited.
[0058] In the next step, the (Cr,Ni)N / DLC composite layer is deposited by magnetron sputtering ion plating: vacuumize 0.8×10 -3 The vacuum degree is above Pa, and then the nitrogen gas (N 2 , the purity is 99.999%), the air pressure is controlled at 0.1-0.4pa, three targets are co-sputtered, the Cr target current is 0.6A, the Ni target current is 0.15A, the C target current is 2.5A, the negative bias voltage is 120V, and the bias frequency is 120kHz. The thickness of the deposited layer is about 6 μm.
[0059] According to the methods in the examples, the (Cr,Ni)N / DLC / CNTs composite layer was prepared.
[0060] In the next step, (Cr,Ni)N / DLC-CF was prepared by glow discharge plasma modification 3 / CNTs-C...
Embodiment 3
[0062] The cleaning and drying of the mold substrate is the same as in Embodiment 1.
[0063] According to the method of Example 1, a metal Cr layer (bonding layer) is deposited.
[0064] According to the method of Example 1, a CrN layer (transition layer) is deposited.
[0065] According to the method of Example 1, the (Cr,Ni)N / DLC composite layer was deposited.
[0066] In the next step, the (Cr,Ni)N / DLC / CNTs composite layer was prepared by heat treatment in a protective atmosphere: the protective atmosphere was argon (Ar, with a purity of 99.99%), the air pressure was normal pressure, and the heating rate was 2°C / min. The temperature is 760°C, the holding time is 8 hours, and it is cooled down to room temperature with the furnace cooling.
[0067] According to the method of Example 1, modified preparation (Cr, Ni) N / DLC-CF 3 / CNTs-CF 3 Composite layer (hard anti-adhesion functional layer).
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