High-resolution all-material Fresnel zone plate array and its fabrication process
An all-material, tape-sheet technology, applied in metal material coating process, instruments, optical components, etc., can solve problems such as preparation difficulties
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[0086] Figure 1 shows an embodiment of a micropillar array (1 ) fabricated by plasma FIB milling a common carrier (2); in this case a single crystal Si wafer. Each micropillar (3) is located in a groove (4) formed in the common carrier (2). In the embodiment shown, said grooves (4) are right cylinders arranged in rows and columns on the common carrier (2). A microcolumn (3) is arranged at the center of each groove (4). Each micropillar (3) stands on the bottom surface (5) of the groove (4) and is oriented along the central axis of the corresponding cylinder. The depth of each groove (4) is equal to the length of each microcolumn (3). The top surface (6) of each micropillar (3) is arranged in the same plane as the upper surface (7) of the common carrier (2). The cone angle (not shown in Figure 1) of each microcolumn (3) is 1°. However, micropillar arrays (1) with any other desired cone angles can be fabricated by plasmonic or other FIBs, and allow the fabrication of ML-FZPs...
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