Preparation method for transparent conductive film

Abstract

The invention provides a preparation method for a transparent conductive film. The preparation method comprises the following steps: S1, selecting a transparent base material; S2, manufacturing a conductive layer on the base material, wherein the conductive layer comprises a plurality of conductive lines distributed in a grid shape; S3, placing an insulating material in a grid. After the technicalscheme is adopted, the method, compared with the prior art, has the advantage that in the present invention, the conductive layer is manufactured on the base material, so the line width and the linedistance of the conductive layer are convenient to control; and then the insulating material is placed, so the adhesion stability between the conductive circuit and the insulating material is good; the conductive circuit is embedded in the insulating layer, so that the conductive circuit has no risk of migration and lap joint, the conductive performance of the product is guaranteed, the conductivematerial is not left on the upper side of the insulating layer, the poor appearance of the product is not caused, wiping is not needed subsequently, the manufacturing process is simpler, and the production efficiency is higher.

Description

technical field [0001] The invention relates to the technical field of conductive films, in particular to a preparation method of a transparent conductive film. Background technique [0002] Transparent conductive film is a film with good conductivity and high transmittance in the visible light band. Common transparent conductive films such as ITO conductive film. The application number is 2013101047443, and the Chinese patent application titled transparent conductive film and its preparation method proposes a preparation method of transparent conductive film, as shown in Figures 1 to 3. The first step is to make a mesh on a transparent substrate. Grid-shaped grooves, the second step is to fill the grooves with conductive materials. When filling, the conductive materials are easy to adhere to the upper side of the insulating area around the grooves, and subsequent wiping is required, but when wiping, if wiping If it is too light, the conductive material remaining on the upp...

AI Technical Summary

Problems solved by technology

The application number is 2013101047443, and the Chinese patent application titled transparent conductive film and its preparation method proposes a preparation method of transparent conductive film, as shown in Figures 1 to 3. The first step is to make a mesh on a transparent substrate. The second step is to fill the groove with conductive material. When filling, the conductive material is easy to adhere to the upper side of the insulating area around the groove. It needs to be wiped later, but when wiping, if you wipe If it is too light, the conductive material remaining on the upper side of the insulation area will cause spot defects and affect the appearance of the product; if it is too heavy, it will reduce the conductive material in the groove and affect the electrical conductivity of the product; Too much filling of conductive material will lead to a larger line width at the upper end of the conductive line, and a smaller line distance between two adjacent conductive lines, which may lead to overlapping, resulting in touch failure; or when the temperature is too high, the conductive The probability of circuit migration is relatively high, which in turn will lead to overlapping, so it is necessary to improve the existing preparation method of transparent conductive film

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