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Curable pressure-sensitive adhesive tapes based on vinyl aromatic block copolymers

A technology of pressure-sensitive adhesive tapes and block copolymers, applied in the direction of mineral oil hydrocarbon copolymer adhesives, adhesives, pressure-sensitive films/sheets, etc., can solve problems such as difficult induction, aging instability, etc.

Active Publication Date: 2022-01-04
TESA SE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, heterogeneous blend systems can have the disadvantage that the morphology of the blend can change over time and / or with increasing temperature, which manifests itself as macroscopic changes in the quality of the polymer and / or product
Correspondingly, it is more difficult to induce crosslinking of elastomeric blocks with a low proportion of 1,2-bonded dienes
However, this self-adhesive composition has the disadvantage that a high proportion of 1,2-bonded diene in the elastomer block of more than 30% by weight is accompanied by aging in the vinylaromatic block copolymer instability

Method used

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  • Curable pressure-sensitive adhesive tapes based on vinyl aromatic block copolymers
  • Curable pressure-sensitive adhesive tapes based on vinyl aromatic block copolymers
  • Curable pressure-sensitive adhesive tapes based on vinyl aromatic block copolymers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0237] The raw materials used are characterized as follows:

[0238] D1101: Styrene-butadiene-styrene triblock copolymer from Kraton Polymers with 16 wt% diblock, block polystyrene content: 31 wt%, 1 in the butadiene block Proportion of 2-bonded conjugated diene: 10% by weight

[0239] D1118: Styrene-butadiene-styrene triblock copolymer from Kraton Polymers with 78 wt% diblock, block polystyrene content: 33 wt%, 1 in the butadiene block Proportion of 2-bonded conjugated diene: 10% by weight

[0240] Dercolyte A115: Solid alpha-pinene tackifying resin with a ring and ball softening temperature of 115°C and a DACP of 35°C

[0241] A25: α-pinene-based polyterpene resin with a ring and ball softening temperature of 22 to 28°C.

[0242] Escorez 2203: Hydrocarbon resin based on C5 and C9, low aromatic content, softening point (ring and ball) 95°C.

[0243] Expancel 920 DU40, Expancel 920DU80: Unexpanded microspheres.

[0244] Ebecryl 140: Bis(trimethylolpropane) tetraacry...

Embodiment B1

[0264] A pressure-sensitive adhesive tape was prepared by method V1 using formulation R1 such that it had a thickness of about 1000 μm. Thickness is always based on pressure sensitive adhesive tape without PET liner.

Embodiment B2

[0266] The preparation of the pressure-sensitive adhesive tape from Example B2 differs from the preparation of the pressure-sensitive adhesive tape from Example B1 only in that the 40% by weight adhesive solution used also contained 2% by weight of A25, based on the dry weight of the resulting solution.

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Abstract

The invention relates to a pressure-sensitive adhesive tape comprising at least one layer SK1 of a self-adhesive composition based on a vinylaromatic block copolymer and containing a tackifying resin, wherein the vinylaromatic block copolymer -contains at least one polymer block A formed primarily by the polymerization of vinylaromatic compounds, and -contains at the same time at least one polymer block B formed primarily by the polymerization of a conjugated diene, wherein in the B block The proportion of 1,2-bonded conjugated dienes is less than 30% by weight, preferably less than 20% by weight; the invention also relates to such pressure-sensitive adhesive tapes in which at least layer SK1 has been subjected to electron irradiation.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive tape based on vinylaromatic block copolymers which can be cured by electron beams and which is particularly suitable for bonding components with non-polar surfaces. Background technique [0002] Adhesives and tapes are commonly used to assemble two substrates in a manner that forms a durable or permanent bond. Despite the variety of adhesives and tapes available, innovative substrates and increased demands on end-use applications necessitate the development of new pressure sensitive adhesives, formulations and tape designs. It has emerged, for example, that new components in the automotive interior area (to which the tape is temporarily or permanently adhered) are critical surfaces and present challenges for adhesive bonding. Due to the low surface energy of these components, tapes specially designed for these applications are required. [0003] Furthermore, the use of adhesive tapes is growing i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/38C09J145/00C09J157/02C09J153/02
CPCC09J7/387C09J145/00C09J153/02C09J157/02C08J2353/02C08J2357/02C08J2445/00C08L2201/08C08L2203/14C08L2205/03C08L2205/025C09J2301/124C09J2301/412C09J2301/302C08L53/02C08K9/10C09J2453/00C09J7/10C09J2301/312C09J2301/408B29B7/007B29B7/845B29B7/485B29C2948/92704B29C48/39B29C48/44B29C48/766C09J11/08C09J2400/24C09J2301/416C09J7/26
Inventor T.舒伯特M.迈耶M.帕彭布罗克M.伦丁J.加伯斯
Owner TESA SE