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Bonding layer and heat dissipation structure for heat dissipation of electronic device

A technology for electronic devices and heat dissipation structures, applied in the direction of non-polymer adhesive additives, electrical components, electrical equipment structural parts, etc., can solve problems such as short circuits of devices, and achieve the effect of preventing dimensional changes and good thermal conductivity

Pending Publication Date: 2019-04-30
江苏金由新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in terms of operation and use, the graphene powder coating is charged and adsorbed on the oppositely charged substrate by using an electrostatic gun, and then cured at a high temperature to form a uniform coating. It is operated in an attractive way, so the substrate must be limited to metal materials to be coated, and the coating thickness is about 50-100um thicker than liquid coating; on the other hand, graphene also has high conductivity, although through some processes The treatment can achieve the insulation effect, but there is still a hidden danger of short-circuiting the device in a high-temperature environment for a long time

Method used

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  • Bonding layer and heat dissipation structure for heat dissipation of electronic device
  • Bonding layer and heat dissipation structure for heat dissipation of electronic device

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Embodiment Construction

[0019] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0020] Please combine figure 1 As shown, a kind of adhesive layer for heat dissipation of electronic devices provided by the present invention comprises:

[0021] An intermediate support layer 1 made of PTFE microporous membrane, the thickness of the intermediate support layer 1 is between 5-20um, preferably 10um. as well as

[0022] One or more layers of heat-conducting and insulating coatings 2 are provided adjacent to both sides of the intermediate support layer 1 , and the thickness of the heat-conducting and insulating coating 2 is between 5-15 um, preferably 10 um. The thermally conductive and insulating coating 2 includes hexagonal boron nitride blended with a binder, and the content of the hexagonal boron nitride is between 30% and 100%. The hexagonal boron nitride has a layered structure similar to graphite, has go...

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Abstract

The invention discloses a bonding layer for heat dissipation of an electronic device. The bonding layer comprises a middle support layer formed by a PTFE micro-porous film, and one or more thermally-conductive insulating coatings adjacent to both sides of the middle support layer, and every thermally-conductive insulating coating comprises hexagonal boron nitride blended with an adhesive. The invention also discloses a heat dissipation structure for heat dissipation of the electronic device. The bonding layer and the heat dissipation structure have excellent thermal conductivity, and has insulating properties.

Description

technical field [0001] The invention relates to heat dissipation technology on electronic devices, and more specifically relates to an adhesive layer for heat dissipation of electronic devices and a heat dissipation structure thereof. Background technique [0002] The power loss of power electronic devices will cause heating and temperature rise of power electronic devices, and excessive device temperature will shorten the life of devices, which is the main reason for limiting the current and voltage capacity of power electronic devices. For this reason, the cooling and heat dissipation of power electronic devices must be considered to ensure that the devices work normally below the rated temperature. There are three general heat dissipation methods, namely: heat conduction, convection, and radiation heat exchange, so the commonly used heat management methods are as follows: When designing circuit boards, deliberately increase the thickness of heat dissipation copper foil or...

Claims

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Application Information

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IPC IPC(8): C09J7/24C09J7/30C09J11/04H05K7/20
CPCH05K7/20472C09J7/245C09J7/30C09J11/04C08K2003/385C09J2301/408
Inventor 顾榴俊黄磊孙玲玲顾根林
Owner 江苏金由新材料有限公司
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