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Water-based epoxy adhesive and application thereof in bonding high-performance fiber bulletproof plate

A technology of water-based epoxy and water-based epoxy resin, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of hardness and rigidity inferior to metal or ceramic materials, and large depression depth, etc., to improve the bulletproof effect , Reduce the depth of the depression, good bonding performance

Active Publication Date: 2019-05-10
BEIJING TONGYIZHONG NEW MATERIAL TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the anti-penetration effect of this kind of bulletproof plate is good, its hardness and rigidity are not as good as metal or ceramic materials, so there are problems such as large depression depth after bullet impact

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Drop into the water of the bisphenol A type epoxy resin E51 of 30 mass parts, the emulsifier OP-10 of 3 mass parts and 65 mass parts in the disperser, be dispersed into aqueous epoxy resin emulsion under high-speed agitation; Then add respectively 1 mass part of wetting agent BYK-340 and 1 mass part of antifoaming agent BYK-306 were stirred for 10 minutes to obtain component A.

[0039] Put 60 mass parts of amine curing agent diethylenetriamine and 2 mass parts of curing accelerator DMP-30 into the disperser, stir evenly, add 30 mass parts of Bayer's commercially available product water-based polyurethane DispercollU53, and continue stirring After 10 minutes, add water to 100 parts by mass to obtain component B.

[0040] According to the epoxy group and active hydrogen equivalent of 1:1.2, mix the above components A and B to obtain an adhesive for bonding high-performance fiber bulletproof panels.

Embodiment 2

[0042] Drop into the water of the bisphenol A type epoxy resin E44 of 35 mass parts, the emulsifier OP-10 of 3 mass parts and 60 mass parts in the disperser, be dispersed into aqueous epoxy resin emulsion under high-speed agitation; Then add respectively 1 mass part of wetting agent BYK-340 and 1 mass part of antifoaming agent BYK-306 were stirred for 10 minutes to obtain component A.

[0043] Put 55 parts by mass of amine curing agent isophorone diamine and 2 parts by mass of curing accelerator DMP-30 into the disperser, stir evenly and add 25 parts by mass of water-based polyurethane AH- 0201, continue stirring for 10 minutes, and add water to 100 parts by mass to obtain component B.

[0044] According to the epoxy group and active hydrogen equivalent of 1:1.1, mix the above components A and B to obtain an adhesive for bonding high-performance fiber bulletproof panels.

Embodiment 3

[0046] Drop into the water of the bisphenol A type epoxy resin E53 of 32 mass parts, the emulsifier OP-10 of 3 mass parts and 65 mass parts in the disperser, be dispersed into waterborne epoxy resin emulsion under high-speed agitation; Then add respectively 1 mass part of wetting agent BYK-340 and 1 mass part of antifoaming agent BYK306 were stirred for 10 minutes to obtain component A.

[0047] Put 55 parts by mass of amine curing agent ethylenediamine and 2 parts by mass of curing accelerator DMP-30 into the disperser, stir evenly, add 32 parts by mass of water-based polyurethane AH-0203, a commercially available product from Anda Huatai Company, and continue Stir for 10 minutes, add water to 100 parts by mass, and obtain component B.

[0048] According to the epoxy group and active hydrogen equivalent of 1:1.1, mix the above components A and B to obtain an adhesive for bonding high-performance fiber bulletproof panels.

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Abstract

The invention provides a water-based epoxy adhesive and an application thereof. The adhesive comprises an epoxy component and a curing component, wherein the epoxy component comprises a water-based epoxy resin emulsion; the curing component comprises an amine curing agent and a water-based polyurethane emulsion; and the water-based polyurethane emulsion is 10-40% of the total mass of the curing component, and the solid content of the water-based polyurethane emulsion is 25-50%. The adhesive adopts an epoxy system in the form of the water-based epoxy resin emulsion, the system has good bondingperformance and excellent hardness and rigidity. In addition, the adhesive mainly toughens the epoxy resin matrix by introducing a certain amount of the water-based polyurethane emulsion components. The application of the adhesive in bonding a high-performance fiber bulletproof plate can ensure the bulletproof plate to obtain excellent impact resistance, reduce the depression depth after impact and improve the bulletproof effect on the premise of ensuring sufficient bonding strength, hardness and rigidity of an adhesive layer.

Description

technical field [0001] The invention belongs to the technical field of adhesives, in particular to a water-based epoxy adhesive and its application in bonding high-performance fiber bulletproof boards. Background technique [0002] Although the development of ceramic bulletproof plates is rapid, the brittle defects of its materials have not been well resolved. Therefore, the role of high-performance fiber bulletproof panels is irreplaceable. The bulletproof mechanism of high-performance fibers is to absorb a large amount of energy and prevent bullets from penetrating through energy transfer. At present, the most commonly used fiber composite sheet with the best bulletproof effect is ultra-high molecular weight polyethylene fiber bulletproof sheet, which is a flexible material. [0003] Existing high-performance fiber bulletproof panels such as ultra-high molecular weight polyethylene fiber bulletproof panels, the preparation process usually includes: unidirectional sprayin...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/08
Inventor 刘金良黄兴良陈振坤魏广恒
Owner BEIJING TONGYIZHONG NEW MATERIAL TECH CORP
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