Electric soldering iron heating type rapid thermal fatigue experimental device and method

Abstract

The invention discloses an electric soldering iron heating type rapid thermal fatigue experimental device and method. The electric soldering iron heating type rapid thermal fatigue experimental devicecomprises a heating system, a refrigerating system, a cooling liquid circulating system and an electric warning counter. The heating system comprises a heating power supply and a welding mouth, a sample placing point is arranged at the side end of the welding mouth, and a first circulating time relay of heating and pause time provided with a heating power supply is connected to the heating powersupply; the refrigerating system comprises a water tank and thermal resistance, a refrigerating piece is arranged at the bottom of the water tank, and a temperature controller is arranged outside thewater tank; and the cooling liquid circulating system comprises cooling liquid filled in the water tank and a water pump connected with the water tank, a cooling liquid circulating pipe is arranged onthe water tank, the middle of the cooling liquid circulating pipe is fixedly connected with the welding mouth, and a second circulating time relay capable of setting cooling time and cooling pause time of a sample is further connected to the water pump. The electric soldering iron heating type rapid thermal fatigue experimental device and method have the advantages of small volume, low cost and high temperature rising speed.

Description

technical field [0001] The invention relates to a thermal fatigue experimental device, in particular to an electric soldering iron heating type rapid thermal fatigue experimental device and an experimental method. Background technique [0002] With the gradual promotion and application of high-power devices such as IGBTs and LEDs, the density of packages is getting higher and higher, the size of solder joints is getting smaller and the number of solder joints is increasing, and the power borne by the chips inside the components is increasing. The larger the temperature, the higher the heat flux density inside the package, and cooling must be carried out in order to better exert its performance. Therefore, the internal solder joints of the components must be subjected to high-frequency and sharp temperature changes during the service process, which will inevitably lead to the mismatch of the thermal expansion coefficients of various materials inside the components, and the so...

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Problems solved by technology

The temperature rise rate of the test device has been greatly improved compared with conventional thermal fatigue, but there is still room for optimization of the temperature rise rate, and the temperature in the low temperature section is too high and needs to be greatly reduced.

At the same time, the existing thermal fatigue experimental device is bulky, expensive, and expensive

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