Electric soldering iron heating type rapid thermal fatigue test device and test method

Abstract

The invention discloses an electric soldering iron heating type rapid thermal fatigue experiment device and an experiment method. The test device includes a heating system, a refrigeration system, a cooling liquid circulation system and an electronic alarm counter. The heating system includes a heating power supply and a welding tip. There is a sample placement point at the end, and the first cycle time relay for setting the heating and pause time of the heating power supply is connected to the heating power supply; the cooling system includes a water tank and a thermal resistor, a cooling plate is installed at the bottom of the water tank, and a Temperature controller; the cooling liquid circulation system includes the cooling liquid installed in the water tank and the water pump connected to the water tank. A cooling liquid circulation pipe is arranged on the water tank. A second cycle time relay capable of setting the cooling time and cooling pause time of the sample is connected. The electric soldering iron heating type rapid thermal fatigue experimental device and experimental method obtained in the present invention have the advantages of small volume, low cost and fast heating rate.

Description

technical field

[0001] The invention relates to a thermal fatigue experimental device, in particular to an electric soldering iron heating type rapid thermal fatigue experimental device and an experimental method. Background technique

[0002] With the gradual promotion and application of high-power devices such as IGBTs and LEDs, the density of packages is getting higher and higher, the size of solder joints is getting smaller and the number of solder joints is increasing, and the power borne by the chips inside the components is increasing. The larger the temperature, the higher the heat flux density inside the package, and cooling must be carried out in order to better exert its performance. Therefore, the internal solder joints of the components must be subjected to high-frequency and sharp temperature changes during the service process, which will inevitably lead to the mismatch of the thermal expansion coefficients of various materials inside the components, and the so...

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