Wafer temperature sensor and position determining method and circuit design method in application thereof

A technology of temperature sensor and determination method, which is applied to thermometers, thermometers using electric/magnetic components directly sensitive to heat, and electric devices, etc. Short time and other problems, to achieve the effect of large thermal gradient value, large heat flux and fast response time

Active Publication Date: 2019-05-14
JIANGSU BEIDOU SATELLITE NAVIGATION DETECTION CENT CO LTD
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Problems solved by technology

[0008] The technical problem to be solved by the present invention is that in order to solve the problem that the temperature of the hot and cold plates of the thermal conductivity measuring instr

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  • Wafer temperature sensor and position determining method and circuit design method in application thereof
  • Wafer temperature sensor and position determining method and circuit design method in application thereof
  • Wafer temperature sensor and position determining method and circuit design method in application thereof

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[0120] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0121] like figure 1 as shown, figure 1 It is a schematic diagram of the overall framework of this embodiment. This embodiment includes a sheet temperature sensor part and its application part. The sheet temperature sensor part includes sensor shape design, material selection and circuit design; the application part includes determination of the temperature position of the measured object and data processing.

[0122] like figure 2 as shown, figure 2 It is a schematic diagram of the principle of measuring the thermal conductivity of an object by the steady-state plate method (unit: mm). A is the heating plate, the temper...

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Abstract

The invention belongs to the technical field of temperature detection and calibration in the metrology industry, and discloses a wafer temperature sensor which can be closely attached to a thermal conductivity cold and hot plate and can accurately measure the temperature of the cold and hot plate of the thermal conductivity measuring instrument by a large heat flux and fast response time of the wafer temperature sensor in a short time. The invention also discloses a position determining method for the wafer temperature sensor on the hot and cold plate of the thermal conductivity measuring instrument, wherein the position point of the hot and cold plate temperature condition of the thermal conductivity measuring instrument can best determined by the finite element simulation technology, andthe K-Means-Mean method is used to continuously eliminate singular values during data detection to finally obtain the optimal temperature value for characterizing the temperature effect. The invention also discloses a circuit design method for a wafer temperature sensor, which proves the accuracy of the measurement data of the wafer temperature sensor.

Description

technical field [0001] The present invention relates to a sheet temperature sensor and its position determination method and circuit design method in its application, in particular to a sheet temperature sensor suitable for detecting the temperature of a metal surface and its detection position determination method and circuit design method, the metal surface to be detected Including the cold and hot plate of the thermal conductivity tester, the digital adjustable heating plate and the microcomputer temperature control heating plate, etc. The invention belongs to the technical field of temperature detection and calibration in the metrology industry. Background technique [0002] Thermal conductivity is an important index to measure materials. Thermal conductivity tester is a common instrument for measuring thermal conductivity. Accurate detection of thermal conductivity tester is related to the lifeblood of many cutting-edge fields. [0003] Materials science is related to ...

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Application Information

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IPC IPC(8): G01K7/20G01N25/20
Inventor 封海兵冯鑫林学勇朱光李磊
Owner JIANGSU BEIDOU SATELLITE NAVIGATION DETECTION CENT CO LTD
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