Carbon-series flexible heat conduction band with high in-plane and vertical heat conduction performance and manufacturing method of carbon-series flexible heat conduction band

Abstract

The invention discloses a carbon-series flexible heat conduction band with high in-plane and vertical heat conduction performance and a manufacturing method of the carbon-series flexible heat conduction band. A flexible heat transfer mechanism used for dissipating heat from a heating body to a heat sink (such as a radiator) is characterized in that a main body heat conduction material of the mechanism is a carbon-series heat conduction sheet, and the carbon-series heat conduction sheet is formed by overlapping, bonding, hot pressing and multi-layer packaging. The heat transfer mechanism is composed of a film-shaped heat conductor and a connector, the film-shaped heat conductor is used for transferring heat from the heat source to the heat sink, and the connector is used for being in low-heat-resistance mechanical connection with the heat source and the heat sink. The interior of the film-shaped heat conductor is composed of a high-heat-conductivity carbon-series heat-conducting sheet, a heat-resistant thin film, a heat-radiation-resistant coating film and a corrosion-resistant and strong-current-resistant insulating heat-shrinkable film. The carbon series flexible heat conduction band disclosed by the invention has the characteristics of in-plane and vertical high heat conduction, flexibility, low thermal resistance, light weight and low radiation.

Description

technical field [0001] The invention belongs to the field of thermal management, and in particular relates to a carbon-based flexible and highly conductive heat transfer mechanism for transferring heat from a heat source to a heat sink. Background technique [0002] As electronic systems become smaller, more powerful, and more efficient, people's requirements for their performance are gradually increasing, which makes the power consumption of heating components in electronic equipment more and more large, and the heat flux density inside the system is getting higher and higher. If the heat generated by heating electronic components or heating equipment cannot be effectively resolved, it will directly affect the reliability and life of the electronic system, and may even cause catastrophic thermal failure. Therefore, the heat transfer of heat-generating electronic components or heat-generating equipment is extremely important. [0003] Especially for the fact that the heat s...

AI Technical Summary

Problems solved by technology

[0003] Especially for the heat sink (such as radiator) and the heat source are not in contact, or even different planes, which cannot be solved by the traditional direct bonding heat dissipation method, and must be connected by a metal heat conduction structure

However, the conversion connection is usually made through a rigid metal heat-conducting structure, which has poor thermal efficiency, high weight, and is limited by the layout and size of the main structure, which often leads to the failure of the overall system to achieve compact layout and miniaturization design requirements. Sometimes the rigid body of the conversion connection cannot even Design and install

[0004] Existing copper flexible conductive tapes mainly include copper wire braided flexible conductive tapes and copper foil multi-layer flexible conductive tapes. Due to the thermal conductivity of copper as the main material is only 400w / m×k, and the joints are directly crimped, contact with heat The effect of large resistance leads to unsatisfactory heat transfer efficiency

[0005] The existing parallel stacked graphene flexible conductive tape, although the surface thermal conductivity of the graphene film system is higher than 800w / m×k, the vertical thermal conductivity is very poor, usually less than 10 w / m×k, plus the vertical Influenced by the stacked adhesive layer (the thermal conductivity is generally less than 0.5w / m×k), the heat at the end is difficult to transfer to the lower layer of the laminated graphene, resulting in different heat transfer capabilities of each layer and insufficient heat flux, which eventually leads to The overall heat transfer efficiency drops significantly

Images