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High-thermal-conductivity graphite film vapor chamber and preparation method thereof

A high thermal conductivity graphite and vapor chamber technology, which is applied in chemical instruments and methods, lamination, coating, etc., can solve the problems of complex processing procedures of vapor chamber structure, vapor chamber coolant return resistance, and high requirements for production equipment , to achieve the effect of light weight, good thermal conductivity, and meet the heat dissipation requirements

Pending Publication Date: 2022-02-25
CHENGDU SIWI HIGH TECH IND GARDEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The processing procedure of this vapor chamber structure is complex and difficult, and requires high production equipment and high production costs.
And for the airborne platform with excessive acceleration, there is a huge resistance to the return flow of the vapor chamber coolant, which reduces its heat transfer efficiency or fails

Method used

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  • High-thermal-conductivity graphite film vapor chamber and preparation method thereof
  • High-thermal-conductivity graphite film vapor chamber and preparation method thereof
  • High-thermal-conductivity graphite film vapor chamber and preparation method thereof

Examples

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preparation example Construction

[0070] A preparation method of a high thermal conductivity graphite film vapor chamber is characterized in that it specifically comprises the following steps:

[0071] Step S1: preparation of laminated board 3;

[0072] Step S2: Install the laminated board 3 in the installation groove 11, and assemble the upper cover 2, the laminated board 3, and the lower cover 1;

[0073] Step S3: Put the assembled blank in a vacuum diffusion welding furnace for welding to complete the preparation.

[0074] In some possible implementations,

[0075] The step S1 specifically includes the following steps:

[0076] Step S11: cleaning and assembling of graphite film and transition layer;

[0077] Step S12: stacking graphite film-transition layer-graphite film; and placing it in a vacuum hot-press furnace to obtain a laminated plate 3 .

[0078] In some possible implementations,

[0079] The step S11 specifically includes the following steps:

[0080] Place the graphite film and the transit...

Embodiment 1

[0096] In this embodiment, the transition layer is made of metal copper sheet; the laminated board and the vapor chamber are prepared by the diffusion welding process;

[0097] Among them, when preparing the laminated board, the vacuum degree of the vacuum hot pressing furnace is 6×10 －3 Pa, the diffusion welding temperature is 800°C, the diffusion welding pressure is 7.0Mpa, the holding time is 30min, and the welding is completed;

[0098] When preparing the vapor chamber, the vacuum degree is 0.9×10 -2 Pa, use a heating rate of 8°C / min to heat the temperature in the vacuum diffusion welding furnace to 560°C and keep it warm for 1.5 hours; Stop pressurization; stop heating and heat preservation, wait for the vacuum diffusion welding furnace to cool down to room temperature, take out the workpiece; carry out finishing and surface treatment on the workpiece to complete the preparation.

Embodiment 2

[0100] In the present embodiment, the transition layer adopts copper plating on the surface of the graphite film, which can be selected from electroplating, electroless plating, ion plating, evaporation, sputtering or vapor deposition; Vapor plate preparation;

[0101] Among them, when preparing the laminated board, the vacuum degree of the vacuum hot pressing furnace is 5 × 10 －3 Pa, the diffusion welding temperature is 800°C, the diffusion welding pressure is 6.8Mpa, the holding time is 20min, and the welding is completed;

[0102] When preparing the uniform temperature plate, the vacuum degree is 0.8×10 -2 Pa, use a heating rate of 5°C / min to heat the temperature in the vacuum diffusion welding furnace to 520°C and keep it warm for 0.5 hours; Stop pressurization; stop heating and heat preservation, wait for the vacuum diffusion welding furnace to cool down to room temperature, take out the workpiece; carry out finishing and surface treatment on the workpiece to complete t...

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Abstract

The invention relates to the technical field of electronic heat dissipation materials, and particularly discloses a high-thermal-conductivity graphite film vapor chamber and a preparation method thereof. The vapor chamber comprises an upper cover, a laminated plate and a lower cover which are sequentially arranged; a mounting groove for mounting the laminated plate is formed in one side, close to the laminated plate, of the lower cover, and a plurality of heat conduction columns are arranged in the mounting groove; a plurality of heat conduction holes matched with the heat conduction columns are formed in the laminated plate; the laminated plate comprises a plurality of layers of laminated graphite films and transition layers arranged between two adjacent layers of graphite films; adjacent graphite films are connected through diffusion welding. The vapor chamber has a high heat conductivity coefficient and is stable and reliable to use under temperature shock and overload acceleration.

Description

technical field [0001] The invention relates to the technical field of uniform temperature and heat dissipation, and more specifically relates to a high thermal conductivity graphite film uniform temperature plate and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the power consumption of devices has increased sharply, and products are developing towards miniaturization and high integration. The requirements for heat dissipation have increased, and the difficulty of heat dissipation has increased. Traditional metals or aluminum alloys have been difficult to meet more and more demanding requirements. According to the performance requirements, VC uniform temperature panels are widely used at present. [0003] At present, the existing vapor chambers are usually made of copper and aluminum alloy materials, and have a micro-structured vacuum chamber inside. After vacuuming and injecting cooling fluid, this type ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/01B32B3/30B32B3/08B32B37/06B32B38/18B32B9/00B32B9/04B32B15/00B32B15/20B32B33/00B32B3/24
CPCB32B15/016B32B3/30B32B3/085B32B37/06B32B38/1858B32B9/007B32B9/04B32B9/041B32B15/00B32B15/20B32B33/00B32B3/266B32B2255/205B32B2307/302
Inventor 徐宁波黄深荣陈晓光祝丽莎李蜀非
Owner CHENGDU SIWI HIGH TECH IND GARDEN
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