A kind of water cleaning type solder paste flux formulation and preparation process thereof
A technology of solder paste and flux, applied in welding equipment, manufacturing tools, welding media, etc., can solve the problems of affecting welding quality, corroding the surface of welding parts, and low efficiency, so as to improve quality and uniformity, ensure production conditions, Reduces corrosive effects
Active Publication Date: 2021-04-30
DONGGUAN SIGMA TIN ALLOY CO LTD
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Problems solved by technology
[0006] (1) During the production of flux, when components such as resin and active agent are decomposed, corrosive substances are easily produced, which will corrode the surface of the weldment and affect the quality of welding;
[0007] (2) During the production of flux, some solid particles will remain in the process of heating and dissolving each component, and the sizes of these solid particles are different, which will affect the uniformity and quality of flux;
[0008] (3) During the production of flux, there will be different heating temperatures at each stage, and the existing production process usually adjusts the heating temperature continuously at each stage. This method is not only inefficient, but also difficult to guarantee Always the right temperature
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[0057] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0058] The invention provides a water-cleaning solder paste flux formula, which consists of the following raw materials in parts by weight:
[0059] 20-40 parts of rosin, 30-45 parts of synthetic resin, 2-5 parts of surfactant, 4-8 parts of organic solvent, 1-3 parts of co-solvent, 1-3 parts of anti-corrosion agent, 1-3 parts of film-forming agent, 2-5 parts of succinic acid, 1-3 parts of corrosion inhibitor, 1-3 parts of antioxidant, 1-3 parts of organic amin...
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The invention discloses a water-cleaning type solder paste flux formula and a preparation process thereof. It consists of the following raw materials in parts by weight: 20-40 parts of rosin, 30-45 parts of synthetic resin, 2-5 parts of surfactant, organic 4-8 parts of solvent, 1-3 parts of co-solvent, 1-3 parts of corrosion inhibitor, 1-3 parts of film former, 2-5 parts of succinic acid, 1-3 parts of corrosion inhibitor, 1-3 parts of antioxidant 1-3 parts of organic amine. The flux produced by this process can reduce its corrosiveness and avoid affecting the quality of welding on the basis of ensuring activity. At the same time, it can grind and pulverize the solid particles in the flux, which is beneficial to improve The quality and uniformity of the flux, in addition, the process does not require frequent temperature adjustments, which can not only improve production efficiency, but also ensure production conditions.
Description
technical field [0001] The invention relates to the field of flux, in particular to a water-cleaning solder paste flux formulation and a preparation process thereof. Background technique [0002] Solder paste is also called solder paste, gray paste, and solder paste is a new type of soldering material that emerged with SMT. It is formed by mixing solder powder, flux, and other surfactants and thixotropic agents. Paste mixture. Solder paste is mainly used for soldering electronic components such as PCB surface resistance, capacitors, and ICs in the SMT industry. Solder paste is divided into water-cleaning solder paste and no-cleaning solder paste. No-cleaning solder paste means that after soldering, the PCB surface is relatively smooth and has less residue. It has passed various electrical performance technical tests and does not need to be cleaned again; water cleaning Type solder paste is to soak the circuit board in water or alcohol for 5 minutes after soldering, clean t...
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IPC IPC(8): B23K35/363
Inventor 李建军
Owner DONGGUAN SIGMA TIN ALLOY CO LTD