Curable particulate silicone composition, semiconductor member comprising curable particulate silicone composition, and molding method for semiconductor member comprising curable particulate silicone composition
A silicone, curable technology, used in semiconductor/solid-state device parts, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of insufficient mechanical strength, warpage, and use of cured products, and achieves processing workability and stability. Excellent curing properties, toughness, toughness, and excellent rigidity
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[0231] Next, the curable granular silicone composition of the present invention and its manufacturing method will be described in detail through examples and comparative examples. In addition, in the formula, Me, Ph, and Vi represent a methyl group, a phenyl group, and a vinyl group, respectively. In addition, for the curable silicone compositions of Examples and Comparative Examples, the softening point, melt viscosity, curability, moldability, warping of molded products, bending strength of cured products, storage elastic modulus, and average Linear expansion coefficient, linear expansion coefficient curve, the results are shown in Table 1.
[0232] [Softening point of hot-melt silicone]
[0233] The heat-fusible silicone was placed on a hot plate set at 25° C. to 100° C., and the temperature at which it became liquefied was used as the softening point while checking the state with a scraper.
[0234] [Softening point of curable granular silicone composition]
[0235]...
reference example 1
[0252] When put into a 1L flask at 25°C, it is a white solid, with an average unit formula:
[0253] (PhSiO 3 / 2 ) 0.80 (Me 2 ViSiO 1 / 2 ) 0.20
[0254] 270.5 g of 55% by mass-toluene solution of resinous organopolysiloxane and 1,3-divinyltetramethyldisiloxane complex of platinum Siloxane solution (platinum metal content = about 4000ppm) 0.034g was stirred uniformly at room temperature (25°C) to prepare a toluene solution of resinous organopolysiloxane (1) containing 10ppm of platinum metal in mass units . In addition, the resinous organopolysiloxane (1) had a softening point of 100°C and a melt viscosity at 100°C of 100 Pa·s.
reference example 2
[0256] When put into a 1L flask at 25°C, it is a white solid, with an average unit formula:
[0257] (PHSiO 3 / 2 ) 0.80 (Me 2 ViSiO 1 / 2 ) 0.20
[0258] 55 mass %-toluene solution 270.5 g of the represented resinous organopolysiloxane, with the formula:
[0259] HMe 2 SiO(Ph 2 SiO)SiMe 2 h
[0260] 21.3 g (with respect to the resin 1 mole of vinyl groups in organopolysiloxane, 0.5 moles of silicon atoms bonded to hydrogen atoms in this component), and 1,3-divinyltetramethyldisiloxane complex of platinum 0.034 g of 1,3-diethylenetetramethyldisiloxane solution (platinum metal content = about 4000 ppm) (the amount of platinum metal is 10 ppm by mass relative to this liquid mixture) was uniformly stirred at room temperature. Then, the temperature in the flask was raised to 100°C using an oil bath, and stirred for 2 hours under reflux of toluene to prepare a resinous organosiloxane derived from the above-mentioned resinous organopolysiloxane and a resinous organopolysiloxa...
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