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Soldering tin propelling and sucking multi-purpose device based on single chip microcomputer

A technology of a propulsion device and a single-chip microcomputer, which is applied in the field of solder suction device and solder propulsion, can solve the problems of increasing the overall weight of the cylinder, short circuits, time-consuming and labor-intensive, etc., and achieve the effects of improving welding efficiency, reducing virtual welding and shortening time.

Pending Publication Date: 2019-05-24
NORTHWEST NORMAL UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the many technologies involved in surface mount technology, soldering technology is the core technology of surface mount technology. With the development of technology, especially the application of reflow soldering and other technologies, the solder paste used is not only used in large quantities, but also requires It is also high, especially it is required that there should be no air bubbles in the solder paste, otherwise the air bubbles may be coated on the solder joints during use, resulting in leakage or virtual soldering. The application can effectively and accurately apply solder paste to PCB (Printed CircuitBoard printed circuit board) at high speed, but compared with mass-produced PCBs, the soldering problem of pcb electronic chips produced by small batches and personal production is unavoidable and needs to be applied one by one. The problem of solder paste, this method is not only time-consuming and labor-intensive, but also has low precision, is difficult to control, and damages eyesight; and in the process of soldering circuit boards, it is inevitable that there is too much solder in the solder joints, especially For those chips with many pins and densely distributed, the excess solder will cause the circuit function test to fail, and it is difficult to find out the problem, which is time-consuming and labor-intensive. If it is serious, it will cause the circuit to short circuit, the chip will burn, and cause unnecessary resources. Waste, the current mainstream solution is to use a solder absorber to suck out or use a copper braided wire to absorb excess solder. Both of these methods require the purchase of related devices to use, which increases the cost
[0003] The patent application "An Automatic Syringe-type Propeller and Its Using Method" (Application No. 201810239424.1, Publication No. CN108313541A, Publication Date: 2018.07.24) discloses a syringe-type propeller whose cylinder structure is too complicated. It is not conducive to production and processing and later combined installation, and while the electric motor, automatic gas generator, power supply and other mechanisms installed inside and above the cylinder increase the production cost, it also increases the overall weight of the cylinder and affects the use of the propeller Flexibility, the most important thing is that the syringe thruster is only suitable for electronic control process, and cannot solve the problem of manual welding

Method used

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  • Soldering tin propelling and sucking multi-purpose device based on single chip microcomputer
  • Soldering tin propelling and sucking multi-purpose device based on single chip microcomputer
  • Soldering tin propelling and sucking multi-purpose device based on single chip microcomputer

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Embodiment Construction

[0014] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0015] Such as figure 1 As shown, the multipurpose device of the present invention includes a cylinder body 3, a needle (6), an air pump 11 and a single-chip control unit 12. One end of the cylinder body 3 is provided with an air inlet, and the air inlet is connected to the air pump 11 through the gas hose 1. The gas port 10 of the air pump is connected, the other end of the cylinder 3 is equipped with a needle 6, the cylinder 3 is covered with a control mechanism 4, the control mechanism 4 is connected with the single-chip microcomputer control unit 12 through the communication wire 9, and the driver 22 on the air pump 11 is controlled by the single-chip microcomputer. Unit 12 is connected.

[0016] Driver 22 employs a portable vacuum pump.

[0017] Such as figure 2 As shown, the cylindrical body 3 in the multipurpose device of t...

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Abstract

The invention discloses a soldering tin propelling and sucking multi-purpose device based on a single chip microcomputer. The soldering tin propelling and sucking multi-purpose device comprises a tubebody, an air pump and a single chip microcomputer control unit; one end of the tube body communicates with the air pump, and the other end of the tube body is provided with a needle holder; and a control mechanism sleeves the tube body, and the control mechanism and a driver on the air pump are both connected with the single chip microcomputer control unit. When the multi-purpose device is used as a soldering tin propelling device, a needle head is mounted on the tube body; and the multi-purpose device solves the problems that in the manual soldering process of printed circuit boards (pcbs),tin feeding of solder joints and solder pads is difficult to control, and cold solder joints are generated well, the time of manual soldering of the pcbs can be effectively shortened, the soldering efficiency is improved, and a lot of convenience is provided for small-batch soldering.

Description

technical field [0001] The invention belongs to the technical field of welding equipment, and relates to a solder advancing and solder absorbing device of surface mount technology, in particular to a multi-purpose device for solder advancing and solder absorbing based on a single-chip microcomputer. Background technique [0002] Surface mount technology is an electronic assembly technology that mounts various electronic components on printed circuit boards or substrates. It is a key technology for the development of electronic products to high integration, high reliability, high precision and low cost. one. Among the many technologies involved in surface mount technology, soldering technology is the core technology of surface mount technology. With the development of technology, especially the application of reflow soldering and other technologies, the solder paste used is not only used in large quantities, but also requires It is also high, especially it is required that t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06B23K37/00
Inventor 梁西银谢凌菲马丽萍蔡坤辉赵博文陈瑞霖文大鹏张天辰吴梦
Owner NORTHWEST NORMAL UNIVERSITY
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