Thermistor material PCB manufacturing method

Abstract

The invention provides a thermistor material PCB manufacturing method. The thermistor material PCB manufacturing method comprises the following steps: cutting a board; forming the circuits of inner layers; etching the inner layers; laminating a plurality of inner-layer boards into a whole under a preset laminating temperature threshold value and a preset pressure threshold value to serve as an outer-layer board; drilling holes; cleaning, and bombarding the hole wall of the outer-layer board by adopting the plasma gas; carrying out copper deposition and electroplating; forming the circuit of anouter layer; etching the outer layer; carrying out resistance welding: coating a protective film on the surface of the outer-layer board. According to the thermistor material PCB manufacturing methodprovided by the invention, a high-temperature process is avoided, and the problem of material modification caused by high-temperature processing is avoided. According to the invention, the inner-layer boards are laminated at a high temperature and a high pressure, so that the resin curing and the surface binding force are ensured. The interconnection reliability of inner layers is improved. According to the invention, the board is bombarded by the plasma gas and then is cleaned, so that the cleaning degree is ensured. The possibility of board oxidation is avoided.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a thermistor material PCB. Background technique [0002] The existing PCB (Printed Circuit Board, printed circuit board) manufacturing technology in the production and manufacturing process: material cutting→baking plate→inner layer circuit→inner layer etching→pressing→drilling→copper sinking→electroplating→outer layer circuit→ Outer layer etching→solder resist→text→surface treatment→electrical test→molding→final inspection→package and shipment, some of the above process has a high temperature above 150°C, which is necessary compared with conventional materials of ordinary epoxy resin systems. However, there will be great defects in the thermistor material. High temperature will easily modify the thermosensitive material, and the increase of resistance threshold will seriously affect the safety of terminal electronic products. At the same tim...

AI Technical Summary

Problems solved by technology

[0002] The existing PCB (Printed Circuit Board, printed circuit board) manufacturing technology in the production and manufacturing process: material cutting→baking plate→inner layer circuit→inner layer etching→pressing→drilling→copper sinking→electroplating→outer layer circuit→ Outer layer etching→solder resist→text→surface treatment→electrical test→molding→final inspection→package and shipment, some of the above process has a high temperature above 150°C, which is necessary compared with conventional materials of ordinary epoxy resin systems. However, there will be great defects in the thermistor material. High temperature will easily modify the thermosensitive material, and the increase of resistance threshold will seriously affect the safety of terminal electronic products.

Images