Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat bonding sheet, and heat bonding sheet with dicing tape

A technology for cutting tapes and sheets, which is applied in the field of heating bonding sheets and heating bonding sheets with cutting tapes, and can solve problems such as thermal characteristics and reliability problems

Active Publication Date: 2019-05-28
NITTO DENKO CORP
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Semiconductor devices for applications with harsh thermal environments assume a high temperature operation of around 250°C, and solder and conductive adhesives, which have been conventional bonding / adhesive materials, have problems in terms of thermal characteristics and reliability.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat bonding sheet, and heat bonding sheet with dicing tape
  • Heat bonding sheet, and heat bonding sheet with dicing tape
  • Heat bonding sheet, and heat bonding sheet with dicing tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0171] 100 parts by weight of copper particles with an average particle diameter of 200 nm and an average particle diameter of crystallites of 31 nm produced by Mitsui Metal Mining Co., Ltd. as copper particles, and an acrylic resin (Fujikura) as a pyrolytic binder B were placed in a stirring container. Kasei Co., Ltd., 14 parts by weight of "MM-2002-1" (solid at 23° C.), 9 parts by weight of 1,6-hexanediol (manufactured by Tokyo Kasei Kogyo Co., Ltd.) as liquid organic component A, and Solvent (methyl ethyl ketone) 30 parts by weight, using a mixing type mixer (manufactured by KEYENCE CORPORATION, "HM-500"), carry out stirring and mixing in stirring mode for 3 minutes. The obtained varnish is coated on a release treatment film (Mitsubishi Plastics Co., Ltd. Co., Ltd. product, "MRA50"), the coating film was dried at 110 degreeC for 3 minutes, and the sheet|seat for thermal bonding of 40 micrometers in thickness was obtained.

Embodiment 2

[0173] 100 parts by weight of copper particles with an average particle diameter of 200 nm and an average particle diameter of crystallites of 31 nm produced by Mitsui Metal Mining Co., Ltd. as copper particles, and polypropylene carbonate resin as pyrolytic binder A (manufactured by Empower Corporation, "QPAC40" (solid at 23°C)) 14 parts by weight, liquid organic component A of 1,6-hexanediol (manufactured by Tokyo Chemical Industry Co., Ltd.) 9 parts by weight, and solvent (methyl ethyl ketone ) 30 parts by weight, using a mixing type mixer (manufactured by KEYENCE CORPORATION, "HM-500"), stirring and mixing were performed in the stirring mode for 3 minutes. The obtained varnish was applied to a release treatment film ("MRA50" manufactured by Mitsubishi Plastics Corporation), and the applied film was dried at 150° C. for 5 minutes to obtain a sheet for thermal bonding with a thickness of 40 μm.

Embodiment 3

[0175] 100 parts by weight of copper particles with an average particle diameter of 200 nm and an average particle diameter of crystallites of 31 nm produced by Mitsui Metal Mining Co., Ltd. as copper particles, and an acrylic resin (Fujikura) as a pyrolytic binder B were placed in a stirring container. Kasei Co., Ltd., "MM-2002-1" (solid at 23° C.), 14 parts by weight, isobornylcyclohexanol (manufactured by Nippon Terpene Chemicals, Inc., "Terusolve MTPH") as liquid organic component B 9 parts by weight, and 30 parts by weight of solvent (methyl ethyl ketone), were stirred and mixed in the stirring mode for 3 minutes using a mixing type mixer (manufactured by KEYENCE CORPORATION, "HM-500"). The obtained varnish was coated on a mold release A film (manufactured by Mitsubishi Plastics Corporation, "MRA50") was processed, and the coating film was dried at 150° C. for 5 minutes to obtain a sheet for thermal bonding with a thickness of 40 μm.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

Provided are: a heat bonding sheet with which it is possible to stably obtain a sintered layer having desired characteristics, and in which changes in composition can be inhibited; and a heat bondingsheet with a dicing tape, having said heat bonding sheet. A heat bonding sheet having a precursor that becomes a sintered layer by heating, wherein the weight loss DeltaW0(%), when an analysis by differential thermogravimetric analysis is performed in a nitrogen atmosphere from 23 DEG C to 400 DEG C at a temperature increase speed of 10 DEG C / min before the heat bonding sheet is exposed to an atmosphere having a temperature of 23 pm 2 DEG C and a humidity of 50 pm 20%, and the weight loss DeltaW24(%), when an analysis by differential thermogravimetric analysis is performed in a nitrogen atmosphere from 23 DEG C to 400 DEG C at a temperature increase speed of 10 DEG C / min after the heat bonding sheet has been exposed to an atmosphere having a temperature of 23 pm 2 DEG C and a humidity of 50 pm 20%, satisfy the following relationship (3). -1% <= DeltaW0-DeltaW24 <= 0.5% (3).

Description

technical field [0001] The present invention relates to a sheet for thermal bonding and a sheet for thermal bonding with a dicing tape. Background technique [0002] In the manufacture of semiconductor devices, the method of bonding semiconductor elements to adherends such as metal lead frames (so-called die bonding method) has evolved from the conventional gold-silicon eutectic to methods using solder and resin paste . Currently, conductive resin pastes are sometimes used. [0003] In recent years, the spread of power semiconductor devices that control and supply electric power has become remarkable. Since current always flows through the power semiconductor device, it generates a large amount of heat. Therefore, it is desired that a conductive adhesive used in a power semiconductor device has high heat dissipation and low resistivity. [0004] Power semiconductor devices are required to operate with low loss and high speed. Conventionally, semiconductors using Si, suc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20H01L21/52
CPCH01L2924/181H01L21/52H01L2224/48091C09J2400/16C09J2400/20C09J2203/326C09J2400/22C09J7/30C09J7/10H01L2224/73265C09J2301/314C09J2301/312H01L2924/00014H01L2924/00012H01L24/29C09J2469/006H01L24/32C09J7/25C09J7/24H01L2221/68377H01L2221/68327H01L2224/2929H01L2224/29339H01L2224/29347H01L2224/29387H01L24/73C09J2433/006H01L21/6836
Inventor 菅生悠树本田哲士
Owner NITTO DENKO CORP