Strain sensor and method of forming same, strain sensor array and method of forming same

A strain sensor and array technology, applied in the field of strain sensors, can solve the problems of less research on flexible strain sensor arrays, complex processing technology, and low integration, so as to improve stability and service life, reliable connection, and improve bonding reliability Effect

Active Publication Date: 2021-11-05
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is little research on flexible strain sensor arrays, its processing technology is complex, and its integration level is not high. In particular, the connection reliability of sensor arrays is still far from commercial applications.

Method used

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  • Strain sensor and method of forming same, strain sensor array and method of forming same
  • Strain sensor and method of forming same, strain sensor array and method of forming same
  • Strain sensor and method of forming same, strain sensor array and method of forming same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] The strain sensor is completed through the following specific steps:

[0074] (1) Utilize ethanol solution, acetone solution and deionized water to ultrasonically clean the glass bottom plate, dry after cleaning, and use oxygen plasma or ultraviolet light / ozone to treat the substrate surface;

[0075] (2) Scrape-coat polyvinylpyrrolidone ethanol solution on the glass bottom plate, and then form a peeling layer by heating and drying;

[0076] (3) Weigh the polydimethylsiloxane material (the mass ratio of prepolymer and curing agent is 10:1), mix it evenly, scrape the mixed material on the release layer, and cure it by heating to form polydimethylsiloxane base silicone elastic substrate;

[0077] (4) The adhesive surface of the polyimide tape and the surface of the polydimethylsiloxane elastic substrate were treated with oxygen plasma, and the polyimide tape was bonded to both sides of the polydimethylsiloxane elastic substrate. side, forming a plasticized layer;

[00...

Embodiment 2

[0084] The strain sensor is completed through the following specific steps:

[0085] (1) Utilize ethanol solution, acetone solution and deionized water to ultrasonically clean the glass bottom plate, dry after cleaning, and use oxygen plasma or ultraviolet light / ozone to treat the substrate surface;

[0086] (2) Scrape-coat polyimide solution on the glass bottom plate, then form a peeling layer by heating and drying;

[0087] (3) Weigh the platinum-catalyzed silica gel material (the mass ratio of component A and component B is 1:1), mix it evenly, scrape the mixed material on the release layer, and cure it by heating to form a platinum-catalyzed silica gel elastic substrate ;

[0088] (4) The adhesive surface of the polyimide tape and the surface of the platinum catalyzed silica gel are treated with oxygen plasma, and the polyimide tape is attached to both sides of the platinum catalyzed silica gel substrate to form a plasticized layer;

[0089] (5) Prepare epoxy resin condu...

Embodiment 3

[0095] The strain sensor is completed through the following specific steps:

[0096] (1) Utilize ethanol solution, acetone solution and deionized water to ultrasonically clean the glass bottom plate, dry after cleaning, and use oxygen plasma or ultraviolet light / ozone to treat the substrate surface;

[0097] (2) Scrape-coat polytetrafluoroethylene solution on the glass bottom plate, and then form a peeling layer by heating and drying;

[0098] (3) Weigh the polydimethylsiloxane material (the mass ratio of prepolymer and curing agent is 10:1), and after mixing evenly, scrape the mixed material on the surface of the polytetrafluoroethylene peeling layer;

[0099] (4) The surface of polyethylene naphthalate film is treated with oxygen plasma, and it is attached to both sides of polydimethylsiloxane to form a plasticized layer; the film and polydimethylsiloxane are removed by vacuuming. Bubbles between the methyl siloxane, the polydimethylsiloxane elastic substrate is cured by he...

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PUM

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Abstract

A strain sensor and its forming method, a strain sensor array and its forming method, wherein the strain sensor comprises: an elastic substrate; a sensitive film located on a part of the surface of the elastic substrate; An electrode connected to two ends; a plasticized layer is formed between the electrode and the elastic substrate. The performance of the strain sensor is improved.

Description

technical field [0001] The invention relates to the technical field of strain sensors, in particular to a strain sensor and a forming method thereof, a strain sensor array and a forming method thereof. Background technique [0002] With the development of flexible electronics, flexible sensing technology has developed into an impressive high-tech intelligent interactive technology. Flexible strain sensors play an important role in realizing the sensing of contact interaction forces between flexible contact interfaces, curved surfaces and irregular flexible contact interfaces, as well as dynamic distribution information sensing. The field of intelligent robots and medical health has very broad market application prospects. [0003] Strain sensors have been reported in three-dimensional space strain measurement (CN201520704420.8), wearable devices (CN201580056298.0), vehicle overload detection (CN201621311300.2), safe driving (CN201711364282.3) and other fields, but single st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B7/16G01L1/20
Inventor 郭小军陈苏杰李明黄钰坤
Owner SHANGHAI JIAOTONG UNIV
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