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Polyimide film for metal lamination and polyimide metal laminate using same

A polyimide film, polyimide layer technology, applied in metal layered products, film/sheet adhesives, coatings, etc., can solve the problem of large dielectric constant and dielectric loss tangent, Problems such as large transmission loss

Active Publication Date: 2019-06-04
UBE IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the high performance of electronic equipment in recent years, higher frequency transmission signals are required, but the conventional polyimide film has a large transmission loss in the high frequency range due to its large dielectric constant and dielectric loss tangent. such problem

Method used

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  • Polyimide film for metal lamination and polyimide metal laminate using same
  • Polyimide film for metal lamination and polyimide metal laminate using same
  • Polyimide film for metal lamination and polyimide metal laminate using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0072] Hereinafter, the present invention will be specifically described based on examples. In addition, the scope of this invention is not limited to an Example.

[0073] [measurement method of each evaluation]

[0074] 1. Water absorption of polyimide film

[0075] The weight increase from the absolute dry weight of the sample after soaking in water at 23° C. for 24 hours or more to absorb water was measured, and the water absorption (saturation) was calculated from the following formula.

[0076] Water absorption (%)=[(weight after water absorption)-(absolute dry weight)] / (absolute dry weight)×100

[0077] In the same manner, the water absorption rate (25° C. / 60% RH) was calculated using a sample that absorbed water for 24 hours or more in a thermo-hygrostat at 25° C. and 60% RH.

[0078] 2. Dielectric properties of polyimide film

[0079] The relative permittivity (ε) and dielectric loss tangent (tanδ) of the polyimide film were measured according to the method of ASTM D...

reference example 1

[0111] The polyamic acid solution A was cast into a film form on a glass plate, heated at 120° C. for 12 minutes using an oven, and peeled from the glass plate to obtain a self-supporting film. The four sides of this self-supporting film were fixed with a pin tenter, and gradually heated in a heating furnace from 150°C to 450°C (the maximum heating temperature was 450°C), and solvent removal and imidization were performed to obtain thickness A 25 μm polyimide film. Table 1 shows the evaluation results of the polyimide film A.

reference example 2

[0113] Except having cast the polyamic-acid solution B into a film form on the glass plate, it carried out similarly to the reference example 1, and obtained the polyimide film B of thickness 25 micrometers. Table 1 shows the evaluation results of the polyimide film B.

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Abstract

The present invention discloses a polyimide film for metal lamination, which is obtained by providing at least one surface of a heat-resistant polyimide layer with a metal bonding layer. This polyimide film has a 5% weight loss temperature of 500 DEG C or higher in a nitrogen atmosphere, while having a dielectric loss tangent of 0.007 or less at a frequency of 11.4 GHz. It is preferable that the metal bonding layer is formed of a thermally fusible polyimide, or is formed of a heat-resistant polyimide and a silane coupling agent. The present invention also discloses a polyimide metal laminate which is obtained by additionally laminating a metal layer on a surface of the above-described polyimide film for metal lamination, said surface having been provided with the metal bonding layer.

Description

technical field [0001] The present invention relates to a polyimide film for metal lamination and a polyimide metal laminate using the polyimide film for metal lamination. Background technique [0002] Polyimide films are widely used as substrate materials of flexible printed circuit boards (FPC) used for wiring of various electronic devices and the like. As a polyimide film used in FPC, a polyimide film having heat-melt adhesiveness is disclosed in Patent Document 1, which is laminated on a heat-resistant polyimide layer and heat-melt-bonded It is formed of a permanent polyimide layer, and a copper-clad laminate using it is also disclosed. [0003] With the high performance of electronic equipment in recent years, higher frequency transmission signals are required, but the conventional polyimide film has a large transmission loss in the high frequency range due to its large dielectric constant and dielectric loss tangent. such a problem. In contrast, Patent Documents 2 a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34B32B27/00C08G73/10C08J5/18H05K1/03
CPCC08J5/18H05K1/03C08J2379/08C08G73/1042C08G73/1071C08G73/1067B32B27/281B32B2255/10B32B2307/748B32B7/12B32B15/18B32B2457/08B32B27/24B32B2264/104B32B15/08B32B2255/26B32B2307/732B32B2255/205B32B2307/204B32B15/20B32B2264/0214B32B2264/102B32B27/08B32B2307/306B32B27/20C09J2400/166C09J2479/08C09J2479/086C09J7/30C09J7/25C09J2203/326B32B7/027C08G73/10B32B27/18
Inventor 小浜慎一郎
Owner UBE IND LTD