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A substrate packaging device for a microfluidic chip

A microfluidic chip and packaging device technology, applied in the field of microfluidics, can solve the problems of long processing cycle, difficult mass production, large channel roughness, etc., and achieve complex operability, save time, and shorten the process cycle Effect

Active Publication Date: 2021-09-21
深圳博华仕科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]In the prior art, in the microfluidic chip processing technology, there are mainly methods such as laser engraving, chemical etching, and photolithography. These methods have their own advantages and disadvantages. The disadvantages are complex operation, long processing cycle, material selection, large channel roughness, and poor repeatability, and it is difficult to produce in batches, so it is difficult to be used as a general and effective chip processing method
With the development of modern numerical control micromachining technology, its processing accuracy and scale can meet the technical requirements of microfluidic chips, but the existing numerical control micromachining equipment is not designed for the design and processing of microfluidic chips , causing unnecessary waste and destruction of materials in application
[0005]Therefore, there is still a lot of room for development in the existing technology

Method used

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  • A substrate packaging device for a microfluidic chip
  • A substrate packaging device for a microfluidic chip
  • A substrate packaging device for a microfluidic chip

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Mutually

[0042] For the positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0043]...

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Abstract

The invention discloses a bottom plate packaging device for a microfluidic chip. The bottom plate packaging device for a microfluidic chip includes: a first conveying component, a second glue coating component, a first pressing component, and the first pressing component. The bonding assembly includes a first pressing roller and a second pressing cylinder corresponding to each other, so as to press the first layer with the encapsulation adhesive layer and the electric strip above the first conveying substrate to each other Combined to form a microfluidic chip strip, the invention uses the printing principle combined with the microfluidic chip manufacturing process to print the microfluidic chip.

Description

technical field [0001] The invention relates to the field of microfluidic technology, in particular to a bottom plate packaging device for a microfluidic chip. Background technique [0002] Microfluidic chip is a new interdisciplinary field and an important development frontier in many fields such as analytical science, micro-electromechanical processing, life science, chemical synthesis, analytical instruments and environmental science in the new century. [0003] The processing technology of microfluidic analysis chips originated from the microfabrication of semiconductor and integrated circuit chips, but the processing size of the chip channel is much larger than that of large-scale integrated circuits. The size of the chip is about a few square centimeters, and the width and depth of the microchannel are on the order of microns. On the other hand, the selection of chip materials, the design of microchannels, the surface modification of microchannels and the fabrication o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00B01L3/00
Inventor 林森冯洁云刘俊杰钟伟兴钟华
Owner 深圳博华仕科技有限公司
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