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High-flexibility and high-resolution photosensitive epoxy acrylic resin composition

A technology of photosensitive epoxy acrylic and resin composition, which is applied in the direction of optics, photomechanical equipment, photoplate making process of patterned surface, etc., can solve the problems of high cost, high risk, poor heat resistance, etc., and achieve high The effect of resolution and high toughness

Active Publication Date: 2019-06-14
HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the compound used to prepare the photosensitive cover film mainly includes epoxy acrylic resin, which has good properties, and the prepared products can easily meet the requirements of acid resistance, alkali resistance and heat resistance. The high modulus makes the prepared photosensitive cover film composition relatively brittle, and the bending resistance is not very good, so researchers have made many improvement measures to solve this problem, trying to improve the bending resistance of the photosensitive cover film
For example, CN107450269A discloses a kind of epoxy resin toughened by nano-core-shell rubber as a curing agent, which can improve the flexibility of the system when added to the photosensitive epoxy acrylic resin. However, this method has uneven coating and high cost Shortcomings; CN104710871B discloses a kind of solder resist ink that utilizes epoxy group-containing acrylate liquid rubber to toughen to obtain good bending resistance, but the heat resistance of this system is not good, and it is easy to fall off after repeated soldering tests; CN1461318A Disclosed is a light-curable-heat-curable composition of a novolac composition extended through an alkylene oxide chain. The composition has good flexibility, but the synthesis process is relatively complicated and dangerous, which makes the cost of the product relatively high

Method used

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  • High-flexibility and high-resolution photosensitive epoxy acrylic resin composition
  • High-flexibility and high-resolution photosensitive epoxy acrylic resin composition
  • High-flexibility and high-resolution photosensitive epoxy acrylic resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The preparation of the high-resolution photosensitive epoxy acrylic resin composition: successively add 2.0g acrylic acid monomer (wherein 0.5g ethoxylated bisphenol A diacrylate , 1.5g 30 ethoxy bisphenol A dimethacrylate), 0.6g photopolymerization initiator (0.3g 2959, 0.3g 907), 0.003g photosensitizer (ITX), 6.0g epoxy resin (3.0 Bisphenol A epoxy resin (g, 3.0g toughened epoxy resin), 0.20g yellow pigment P3440, 0.5g other additives, stirred at high speed to dissolve and disperse, and finally filtered to obtain the composition, and stored in dark light for future use.

Embodiment 2

[0024] The preparation of the photosensitive epoxy acrylic resin composition of high resolution: successively add 2.0g acrylic acid monomer (wherein 0.5g polyethylene glycol (400) diacrylic acid ester, 1.5g30 ethoxy bisphenol A dimethacrylate), 0.6g photopolymerization initiator (0.3g 2959, 0.3g 907), 0.003g photosensitizer (ITX), 6.0g epoxy resin (3.0 Bisphenol A epoxy resin (g, 3.0g toughened epoxy resin), 0.20g yellow pigment P3440, 0.5g other additives, stirred at high speed to dissolve and disperse, and finally filtered to obtain the composition, and stored in dark light for future use.

Embodiment 3

[0026] The preparation of the high-resolution photosensitive epoxy acrylic resin composition: successively add 2.0g acrylic acid monomer (wherein 0.5g polypropylene glycol (600) diacrylate, 1.5 g30 ethoxylated bisphenol A dimethacrylate), 0.6g photopolymerization initiator (0.3g 2959, 0.3g 907), 0.003g photosensitizer (ITX), 6.0g epoxy resin (3.0 bisphenol A Epoxy resin (g, 3.0g toughened epoxy resin), 0.005g boron trifluoride ethylamine latent curing accelerator, 0.20g yellow pigment P3440, 0.5g other additives, high-speed stirring to dissolve, disperse, and finally filter to obtain The composition is stored in dark light for future use.

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Abstract

The invention discloses a high-flexibility and high-resolution photosensitive epoxy acrylic resin composition. The composition mainly comprises 100 parts by weight of alkali-soluble photosensitive epoxy acrylic resin with an acid value of 60-150 mg KOH / g, 1-40 parts by weight of epoxy resin, 1-40 parts by weight of an acrylate monomer and 0.1-10 parts by weight of a photoinitiator and 0.5-2 partsby weight of a coloring agent, wherein the acrylate monomer comprises 1-10 parts by weight of a long-chain ethyoxyl bisphenol A dimethacrylate bifunctional monomer. The composition has excellent bending resistance, high resolution, acid and alkali resistance and tin soldering heat resistance.

Description

technical field [0001] The invention relates to a resin composition used for printed circuit boards, in particular to a highly flexible, high-resolution photosensitive epoxy acrylic resin composition. Background technique [0002] Nowadays, with the miniaturization, thinning and high-density requirements of information terminal equipment, the traditional flexible printed circuit board preparation method gradually shows various disadvantages, such as cumbersome and time-consuming process steps and low yield. In order to solve the above problems, researchers are devoting themselves to the development of photosensitive cover films used to replace traditional cover films and solder resist inks. The photosensitive cover film is used to cover and protect the flexible circuit under heat (high temperature), humidity, pollutants, corrosive gases and harsh environments. The photosensitive cover film is positioned and pressed, and then The transfer of the image is combined with the ci...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/038
Inventor 曹文晓童荣柏周光大林建华
Owner HANGZHOU FIRST ELECTRONIC MATERIAL CO LTD
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