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Inverted T-shaped tunneling field effect transistor

A tunneling field effect and transistor technology, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low on-state current, low tunneling efficiency, and difficult to meet, and achieve low sub-threshold swing and good gate. The effect of control

Inactive Publication Date: 2019-06-18
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, the band tunneling efficiency of ordinary tunneling field effect transistors is low, so that the on-state current of ordinary tunneling transistors is lower than that of traditional field effect transistors, and the gate voltage of tunneling transistors can be both forward and reverse biased. Generates a considerable amount of tunneling current, which makes the device have a large static power consumption
It is difficult to meet the device requirements of large-scale integrated systems, so a new type of structural device is required to maintain a steep sub-threshold swing while significantly reducing static power consumption and increasing the forward on-state current when the transistor is turned on

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0029] An inverted T-type tunneling field effect transistor, comprising a silicon substrate of an SOI wafer, a substrate insulating layer of the SOI wafer above the silicon substrate of the SOI wafer, and a heavily doped substrate above the insulating layer of the SOI wafer The impurity source region, two single crystal silicon thin films and two heavily doped drain regions, in which the heavily doped source region is located in the middle above the substrate insulating layer, and the two single crystal silicon thin films are both L-shaped, located at the heavily doped source The two heavily doped drain regions are located on the L-shaped bottom of the monocrystalline silicon film and are close to the outer edge of the lateral edge of the substrate insulating layer of the SOI wafer, and are located on the substrate insulating layer. above; there is a ga...

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Abstract

The invention provides an inverted T-shaped tunneling field effect transistor. A substrate insulating layer of an SOI wafer is arranged above a silicon substrate of the SOI wafer; a heavily-doped source region, two monocrystalline silicon thin films and two heavily-doped drain regions are arranged above the substrate insulating layer of the SOI wafer; gate insulating layers are arranged on the twosides of the L shape of the two monocrystalline silicon thin films respectively; the two sides of each gate insulating layer are provided with insulating medium barrier layers respectively; gates arearranged on the two sides of each gate insulating layer, and above the insulating medium barrier layers; the two gates are positioned on the insulating medium barrier layers on the two sides respectively and are in contact with the gate insulating layers on the two sides respectively; gate electrodes are located above the gates; source electrodes are located above the heavily-doped source region;and drain electrodes are located above the heavily-doped drain regions. The inverted T-shaped tunneling field effect transistor has good gate control capability, and has excellent sub-threshold characteristics and forward conduction capability, so that a device has good low reverse leakage current and static power consumption while the forward characteristics are ensured.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a tunneling field effect transistor with low power consumption. Background technique [0002] With the development of ultra-large-scale integrated circuits, the size of traditional semiconductor devices has become smaller and smaller. However, it has not only increased the difficulty of manufacturing in the production process, but also various adverse effects have become more and more obvious. When the size of semiconductor devices enters the nanometer era, due to its own physical characteristics, its subthreshold swing can never break through the limit of 60mV / dec, and there are also problems such as excessive reverse leakage current. In response to these problems, researchers have proposed a more effective way to solve the problem of subthreshold swing, using a new type of device tunneling field effect transistor to replace the traditional field effect transistor, reduci...

Claims

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Application Information

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IPC IPC(8): H01L29/06H01L29/417H01L29/423H01L29/739
Inventor 韩茹张海潮王党辉安建峰黄小平张萌陈超
Owner NORTHWESTERN POLYTECHNICAL UNIV
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