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A lumped parameter ipd broadband coupler

A lumped parameter, coupler technology, applied in the field of electronics, can solve problems such as size increase, disadvantageous device or integrated circuit miniaturization, etc., and achieve the effect of low insertion loss, high cost performance and high cost performance

Active Publication Date: 2021-04-06
NANJING UNIV OF POSTS & TELECOMM
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, as the number of branch lines increases, its size will also increase significantly, which is very unfavorable for the miniaturization of devices or integrated circuits.

Method used

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  • A lumped parameter ipd broadband coupler
  • A lumped parameter ipd broadband coupler
  • A lumped parameter ipd broadband coupler

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Embodiment Construction

[0023] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] Such as figure 1 , the lumped parameter broadband coupler of the present invention includes a ground metal layer, a substrate, a dielectric layer and an LC broadband coupler. The substrate is a gallium arsenide substrate, and the dielectric layer is a SiNx substrate. The ground metal layer is located on the lower surface of the substrate and is connected to the LC broadband coupler through the TGV gallium through hole in the substrate. The dielectric layer is located on the upper surface of the substrate. The LC broadband coupler is distributed in three metal layers M1, M2 and M3, the first metal layer M1 is arranged above the upper surface of the dielectric layer, and the second metal layer M2 and the third metal layer M3 are integrated in the dielectric layer Among them, the third metal layer M3 is close to the upper surface of the substrate, and the seco...

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Abstract

The invention relates to a lumped parameter IPD broadband coupler, which includes a two-layer substrate and an integrated LC broadband coupler; the two-layer substrate is a first layer of gallium arsenide dielectric substrate and a second layer of SiNx dielectric substrate; the present invention The invention uses the equivalent λ / 4 transmission line of the lumped parameter equivalent circuit, uses the equivalent matrix theory to obtain the inductance and capacitance values ​​in the equivalent circuit, and makes full use of the technological advantages to effectively reduce the size; increase the number of branch lines to increase The purpose of the bandwidth; for the real object whose center frequency is 4.7GHz, its parameter is better than -24dB; its parameter is better than -40dB, the coupling difference is plus or minus 0.5dB, and the size is 1mm*1.6mm. The present invention has high integration, High cost performance, small size, low insertion loss, good frequency selection performance, good temperature stability and other advantages.

Description

technical field [0001] The invention relates to an IPD broadband coupler, which belongs to the field of electronic technology, in particular to a lumped parameter IPD broadband coupler. Background technique [0002] Branch line coupler, a 90 degree or quadrature hybrid coupler, is widely used in various industries. Branch line couplers are passive devices commonly used in single antenna transmitter systems and I / Q (signal splitter / combiner). With the gradual miniaturization of integrated circuits, on the premise that the center frequency and bandwidth meet the requirements, it is expected to develop a coupler with a size as small as possible. [0003] However, on the one hand, traditional branch line couplers are mostly branch line couplers with distributed parameters. The length of each branch line and main line is restricted by its center frequency, and the lower the center frequency, the larger its size. Theoretically, on a dielectric substrate with a dielectric constan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/12
Inventor 管翰林程勇夏卫鹏
Owner NANJING UNIV OF POSTS & TELECOMM
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