Lead-free anti-oxidation tin paste and preparation method thereof

Abstract

The invention discloses a lead-free anti-oxidation tin paste and a preparation method thereof. According to main points of the technical scheme, the tin paste is prepared from the following componentsin percentage by weight: 1% to 3% of Ni, 0.4% to 0.8% of Cu, 8% to 11% of alloy metal, 10% to 20% of scaling powder, and the balance of Sn; and the scaling powder is prepared from the following components in percentage by weight: 80% to 90% of a carrier, 3% to 9% of an activating agent, 2% to 6% of a surface activating agent, and 1.5% to 5.5% of an inhibitor. The lead-free anti-oxidation tin paste is good in halogen-free anti-oxidation, activity and printing durability of the tin paste are improved, wetting performance of solders to substrates is improved, and a certain collapse resistance performance is provided.

Description

[0001] 【Technical field】 [0002] The invention relates to a solder paste material, more specifically a lead-free anti-oxidation solder paste and a preparation method thereof. [0003] 【Background technique】 [0004] Welding technology has been developed for more than sixty years, and with the continuous development of science and technology, welding technology has been continuously developed and innovated. As one of the commonly used forms of electronic solder, solder paste is constantly developing and innovating with the advancement of science and technology. At present, the development of soldering material products has formed a direction of lead-free, halogen-free, environmental protection and functionalization in terms of composition; In terms of product cost performance, it develops in the direction of reliable quality and low cost; in product application, it develops in the direction of refinement, specialization, and narrower distribution span, and various evaluation te...

AI Technical Summary

Problems solved by technology

[0005] In recent decades, in the soldering process of electronic products, rosin resin fluxes mainly composed of rosin, resins, halide-containing active agents, additives and organic solvents are generally used. Although this type of flux can be soldered Good performance and low cost, but the residue after welding is high, and the residue contains halogen ions, which will gradually cause problems such as electrical insulation performance decline and short circuit. To solve this problem, the rosin resin on the electronic printed board must be used to help Flux residues are cleaned, which will not only increase production costs, but also the cleaning agent used to clean rosin resin-based flux residues is mainly fluorochlorine compounds, which are substances that deplete the atmospheric ozone layer and are banned and eliminated. Before the solder paste printing or injection coating, because the anti-collapse performance of the solder paste is not strong, the solder paste will expand to the predetermined position, that is, the collapse of the solder paste will make the adjacent circuit patterns connected, resulting in short circuit or solder joint displacement. , the new solder paste needs to overcome the above defects at the same time

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