Low dielectric material

Abstract

The invention relates to a low dielectric material comprising: (i) 5-50 parts by weight of polyphenylene ether with a number average molecular weight (Mn) of 1000-4000, a weight average molecular weight (Mw) of 1000-7000, and a Mw / Mn of 1.0-1.8; (ii) 10-90 parts by weight of liquid crystal polymer with an allyl group, wherein Mn=1000-4000, Mw=1000-5000, and Mw / Mn=1.0-1.8; (iii) 0.01 to 15 parts byweight of bismaleimide resin; and (iv) 0.01-10 parts by weight of a polymer additive, wherein the low dielectric material has a Dk value of 3.4- 4.0, and a Df value of 0.0025-0.0050. The low dielectric material can be applied to a prepreg or a circuit board insulating layer, and has the advantages of high Tg, low coefficient of thermal expansion, low water absorption, and excellent dielectric properties such as dielectric constant (Dk) and dielectric loss (Df).

Description

technical field [0001] The present invention relates to a low dielectric material, in particular to a resin composition. Background technique [0002] With the vigorous development of wireless transmission products and the advancement of high-frequency transmission technology, the existing epoxy resin and phenolic resin system materials can no longer meet the advanced applications, especially the needs of high-frequency printed circuit boards. [0003] Fluorine-based resins are used as substrate materials for printed circuit boards with low dielectric loss, but such resins are expensive and difficult to process, and their applications are limited to military and aerospace applications. In addition, polyphenylene ether (PPE) resin has good mechanical properties and excellent dielectric properties, such as dielectric constant (Dk) and dielectric loss (Df), and has become the preferred resin material for substrates of high-frequency printed circuit boards. [0004] However, po...

AI Technical Summary

Problems solved by technology

[0004] However, polyphenylene ether is a kind of thermoplastic resin, and it has the following disadvantages when it is directly used in copper foil substrates: high melt viscosity, difficult to process and shape; poor solvent resistance, easy to cause wires in the environment of solvent cleaning in the printed circuit board manufacturing process. The adhesion is not firm or falls off; and the melting point is close to the glass transition temperature (Tg), it is difficult to withstand the soldering operation above 250°C in the printed circuit board process

However, due to the difference in the polarity of the chemical structure, PPE often has poor compatibility with these active groups or thermosetting resins, is difficult to process, or loses the original excellent characteristics of PPE.

Images