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New application of 2,2'-dithiobipyridine, electroplating hole-filling additive using it and electroplating method using the additive

A technology of dithiobipyridine and additives, which is applied in the field of compounds, can solve the problems of low final yield, high synthesis cost, pungent odor, etc., achieve high conductivity and reliability, shorten the time used, and reduce production costs Effect

Active Publication Date: 2020-12-18
BOMIN ELECTRONICS CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the through-hole plating filling and leveling agents on the market are self-synthesized or a mixture of several organic nitrogen-containing macromolecular compounds. The preparation raw materials and synthesis process are complicated, and the final yield is low, and there is a pungent smell. It is extremely toxic to aquatic organisms, pollutes the environment, is generally highly corrosive and its preparation process is complicated, the investment cost is high, and it is easy to mix organic matter, which leads to complex and uncontrollable chemical reactions and then affects its overall plating. liquid stability
For example: Patent CN 103572335 A is a mixture of leveling agent A and leveling agent B; wherein, leveling agent A is polyvinylimidazolium quaternary ammonium compound, and leveling agent B is N-vinylimidazole (moisture absorption , corrosive) and epoxy compound polymers, which are mixtures of macromolecular organic compounds, the synthesis cost is high, and the polymer is prone to degradation in an aerobic environment, and there are complex and uncontrollable chemical reactions that lead to its The stability of the plating solution is poor when it exists for a long time; the leveling agent used in the patent CN 108166030 A is a macromolecular amine compound, such as polyethylene polyamine, polyallylamine, the former has a pungent ammonia smell, and It is very easy to react with moisture and carbon dioxide in the air to absorb moisture, and has a certain degree of corrosion. In particular, this compound is extremely toxic to aquatic organisms and pollutes the water environment. The latter has complex raw materials and conditions, and the synthesis yield is low. thereby increasing the cost

Method used

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  • New application of 2,2'-dithiobipyridine, electroplating hole-filling additive using it and electroplating method using the additive
  • New application of 2,2'-dithiobipyridine, electroplating hole-filling additive using it and electroplating method using the additive
  • New application of 2,2'-dithiobipyridine, electroplating hole-filling additive using it and electroplating method using the additive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045]1. Preparation of test board

[0046]Cutting→Drilling→Cleaning→Immersing Copper (Take the through-hole plate with a depth-to-diameter ratio of 1.2:1 as an example):

[0047]2. The specific steps of the through hole plating and filling process:

[0048](1) Preparation of electroplating solution

[0049]formula:

[0050]

[0051]Preparation method

[0052]Step 1: Weigh copper sulfate in a beaker;

[0053]Step 2: Add deionized water and stir to dissolve;

[0054]Step 3: Measure the sulfuric acid and slowly inject it into the copper sulfate solution, stir and dilute until completely dissolved;

[0055]Step 4: Add chloride ions, accelerators and inhibitors to the dissolved copper sulfate solution;

[0056]Step 5: Add the new leveling agent, stir until the solution is evenly mixed, and cool to room temperature for later use.

[0057](2) Sample pretreatment: degreasing → washing → acid leaching

[0058]Degreasing: As the test board will inevitably have grease, fingerprints and other dirt on the surface during the preparat...

Embodiment 2

[0065]1. Preparation of test board:

[0066]Cutting→Drilling→Cleaning→Immersion of copper (taking the 1.2:1 through-hole plate as an example)

[0067]2. The specific steps of the through hole plating and filling process:

[0068](1) Preparation of electroplating solution

[0069]formula:

[0070]

[0071]

[0072]The preparation method is the same as in Example 1.

[0073](2) Sample pretreatment: degreasing → washing → acid leaching

[0074]Degreasing: As it is inevitable that the test board will have grease, fingerprints and other dirt on the surface during the preparation process, in order to make the pretreatment effect better, degreasing is required to remove organic pollutants on the copper surface. The degreasing temperature is controlled at 45±5 ℃, degreasing time is 2-3min;

[0075]Washing: First rinse with a large amount of tap water to ensure that the insoluble matter in the degreasing liquid is rinsed, and then rinse with deionized water to reduce the impact of metal ions in the tap water on the sampl...

Embodiment 3

[0081]1. Preparation of test board:

[0082]Cutting→Drilling→Cleaning→Immersion of copper (taking the 1.2:1 through-hole plate as an example)

[0083]2. The specific steps of the through hole plating and filling process:

[0084](1) Preparation of electroplating solution

[0085]formula:

[0086]

[0087]The preparation method is the same as in Example 1.

[0088](2) Sample pretreatment: degreasing → washing → acid leaching

[0089]Degreasing: As it is inevitable that the test board will have grease, fingerprints and other dirt on the surface during the preparation process, in order to make the pretreatment effect better, degreasing is required to remove organic pollutants on the copper surface. The degreasing temperature is controlled at 45±5 ℃, degreasing time is 2-3min;

[0090]Washing: First rinse with a large amount of tap water to ensure that the insoluble matter in the degreasing liquid is rinsed, and then rinse with deionized water to reduce the impact of metal ions in the tap water on the sample;

[009...

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Abstract

The invention discloses a new purpose of 2,2'- dithiopyridine, an electroplating hole filling additive with the same and an electroplating method adopting the additive, specifically, the purpose of 2,2'- dithiopyridine serving as the electroplating hole filling leveling agent, and belongs to the technical field of electroplating leveling agent. The additive is composed of 200 to 300 ppm of an inhibitor, 5 to 11 ppm of an accelerating agent and 7 to 15 ppm of 2,2'- dithiopyridine. The application of the 2,2'- dithiopyridine to the electroplating hole filling leveling agent is provided, and the2,2'- dithiopyridine is used for electroplating hole filling of a circuit board.

Description

Technical field[0001]The invention relates to a new use of a compound, and more specifically, to the use of 2,2'-dithiodipyridine as an electroplating hole-filling and leveling agent. The invention also relates to a special additive for electroplating hole filling using the compound and an electroplating method using the additive.Background technique[0002]With the rapid development of the electronics industry, this has also contributed to the growing growth of the Printed Circuit Board (PCB) industry. The printed circuit board is one of the indispensable and important components of electronic products. It has two major functions, namely supporting circuit components and interconnecting circuit components. Through holes are used to achieve high-density electrical interconnection. hole. Nowadays, traditional through-hole electroplating generally uses plugging methods, which are mainly divided into resin plug holes, conductive rubber plug holes, and through-hole electroplating copper f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/424
Inventor 王旭张胜涛陈世金郭海亮罗佳玉巫萃婷徐缓
Owner BOMIN ELECTRONICS CO LTD